Gauss laser beam shaping method and device and precise laser micropore processing device

Abstract

The invention relates to the field of laser application, and in particular relates to a Gauss laser beam shaping method and a Gauss laser beam shaping device and a precise laser micropore processing device. A beam expanding device, a shaping device, an initial focusing lens, a hole diaphragm, a collimation device, a light beam deflection device and a focusing lens are sequentially arranged along the light path, wherein the Gauss laser beam is shaped as a flat laser beam by the shaping device after being expanded through the beam expanding device, the flat laser beam is collimated by the collimation device after being intercepted by the hole diaphragm and initially focused by the initial focusing lens, a transmission direction of the flat laser beam is changed through the light beam deflection device, and then the flat laser beam is focused through the focusing lens to obtain the laser beam for micropore processing. The Gauss laser beam is output after being shaped as the flat laser beam, the utilization rate and the processing efficiency of the laser are improved, and the energy loss is reduced; meanwhile, when the flat laser beam obtained through the focusing of the focusing lens is used for micropore processing, the hole margin of each of a through hole and a blind hole is smooth, the taper of the hole is reduced, the bottom damage of the blind hole is avoided, and the blind hole with a flat bottom is obtained.

Description

technical field [0001] The invention relates to the field of laser applications, in particular to a Gaussian laser beam shaping method and device and a precision laser microhole processing device. Background technique [0002] In laser precision processing technology, precision laser microhole processing technology refers to the use of various laser beams to reach the melting point or boiling point of the material in a short period of time. For materials that are difficult to achieve micropore processing by traditional methods, the hole diameter is less than 1000mm. Micron micro-hole processing, for example, for metals with high hardness (such as tungsten alloy, titanium alloy, stainless steel, aluminum, etc.), or non-metallic materials with high hardness and high brittleness (such as alumina ceramics, aluminum carbide ceramics, etc.) , Processing holes with a diameter of less than 1000 microns. The precision laser micro-hole processing method has good quality, high repeata...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a Gaussian laser beam shaping method and device and a precision laser microhole processing device for the above-mentioned defects of the prior art, so as to overcome the problem of laser utilization rate when Gaussian laser is used for production and processing in the prior art. Low, large energy loss. When processing micro-vias and blind holes, the edge of the hole is not smooth. With the continuous deepening of the hole, it will produce taper, and the bottom of the hole is prone to depression when processing blind holes, and even the bottom of the hole is broken down.

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