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Method for treating waste etching liquid

A technology of etching waste liquid and acidic etching waste liquid, which is applied in chemical instruments and methods, multi-stage water/sewage treatment, neutralized water/sewage treatment, etc., can solve the problems of waste, expensive use, complicated process, etc., and achieve Recycling, low cost effects

Active Publication Date: 2017-02-08
NEW FOUNDER HLDG DEV LLC +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If these acidic or alkaline etching waste liquids are not treated, the environment will be polluted, and useful materials such as copper in the etching waste liquid will be wasted.
[0003] At present, the treatment methods for alkaline or acidic etching waste liquid include: electrolytic copper extraction treatment method, for example, the electrolytic treatment method recorded in the invention patent CN102206823A, the disadvantage of this method is that the process is complicated and the investment is large; the solvent extraction method, which is about to The extraction agent is added to the alkaline etching waste liquid to obtain a copper-containing solution and an etching regeneration solution. The disadvantage of this method is that it needs to use an expensive extraction agent and the process is cumbersome; A method for purifying copper by reduction with hydrazine hydrate is recorded. The disadvantage of this method is that the process control is complicated and the cost is high

Method used

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  • Method for treating waste etching liquid

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Embodiment approach

[0037] According to a preferred embodiment of the present invention, the method further includes collecting ammonia gas and passing it into water, and passing through carbon dioxide to prepare ammonium bicarbonate.

[0038] According to a preferred embodiment of the present invention, sulfuric acid is added to the copper-containing precipitate to prepare a copper sulfate solution, which is crystallized to prepare CuSO 4 ·5H 2 O crystals.

[0039] According to a preferred embodiment of the present invention, the flocculant can be reused multiple times, preferably 5 times.

[0040] According to a preferred embodiment of the present invention, the flocculated flocs are separated by filtration or centrifugation.

[0041] According to a preferred embodiment of the present invention, the COD of the flocculated etching waste liquid is reduced to below 40 mg / L, and the arsenic content is reduced to below 0.8 ppm.

[0042] According to one aspect of the present invention, there is p...

Embodiment 1

[0061] With the acidic etching waste liquid 1000L (wherein the acidic etching waste liquid contains the Cu of 140g / L) from the acidic etching workshop of Founder Group Gaomi Electronics Co., Ltd. 2+ , 2.0mol / L hydrochloric acid, 4000mg / L COD and 15ppm arsenic, and the pH is about 1.0) added to 500L alkaline etching waste liquid from the alkaline etching workshop of Founder Group Gaomi Electronics Co., Ltd. (wherein alkaline etching Liquid contains 130g / L Cu 2+ , 10mol / L ammonium ion, 3800mg / L COD and 15ppm arsenic, where the pH is about 8.8). The volume ratio of acidic etching waste liquid to alkaline etching waste liquid is 2:1. The pH value of the mixed etching waste solution was adjusted to 7.5 with 1 mol / L soda ash solution, and heated to 95° C. for 2 hours to react. The released ammonia gas (approximately 4.78kM) was collected, and a 3.2kM CuO precipitate and filtrate were obtained by centrifugation.

[0062] Pass the collected ammonia gas into water and then into CO ...

Embodiment 2

[0067] With the acidic etching waste liquid 1000L (wherein this acidic etching waste liquid contains the Cu of 145g / L) from the acidic etching workshop of Founder Group Multilayer Circuit Board Company 2+ , 2.0mol / L hydrochloric acid, 4500mg / L COD and 15ppm arsenic, and the pH value is 1.0) to 1000L alkaline etching waste liquid 1000L from the alkaline etching workshop of Founder Group Multilayer Circuit Board Company (wherein the alkaline Etching waste liquid contains 125g / L Cu 2+ , 10mol / L of ammonium ions, 4000mg / L of COD and 15ppm of arsenic, wherein the pH is 8.8). The volume ratio of acidic etching waste liquid to alkaline etching waste liquid is 1:1. The pH value is adjusted to 12-13 with NaOH particles, and the mixed etching waste solution is heated to a temperature of 100°C. Collect the released ammonia gas (about 9.6kM), and obtain Cu(OH)-containing 2 And CuO precipitate (copper-containing 4.2kM) and filtrate.

[0068] Pass ammonia gas into water and then gas CO ...

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Abstract

The invention provides a method for treating a spent etching solution and treating equipment thereof. The method, provided by the invention, for treating the spent etching solution comprises the following steps: mixing an acidic spent etching solution with an alkaline spent etching solution; regulating a pH value of the mixed spent etching solution and heating to ensure that the acidic spent etching solution reacts with the alkaline spent etching solution; adding a flocculating agent in filtrate to flocculate suspended particles and suspension colloidal arsenic in the filtrate. According to the method or equipment provided by the invention, the spent etching solution is massively treated in a simple low-cost manner, so that the recycling of copper and ammonia is realized; meanwhile, COD of the spent etching solution is reduced to be below 40mg / L, and the content of the arsenic is reduced to be below 0.8ppm, so that the state specified emission standard of waste water is reached.

Description

technical field [0001] The invention relates to the field of environmental protection technology of recycling, in particular to a method and equipment for treating waste etching liquid. Background technique [0002] In the etching process of manufacturing printed circuit boards (PCBs), it is necessary to use a large amount of alkaline etching solution or acidic etching solution to process printed circuit boards, so that the etching process produces a large amount of alkaline etching waste liquid containing copper, ammonia, arsenic and other substances Or acid etching waste liquid. At present, some manufacturers use acid etching process, while others use alkaline etching process. Acid etching is suitable for inner layer, Allegro, and ordinary single- and double-sided panels, and its etching speed is relatively slow; alkaline etching is suitable for high-precision boards, and its etching speed is relatively slow. quick. If these acidic or alkaline etching waste liquids are n...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C02F9/04C01G3/02C01C1/02C01C1/26C02F1/66C02F1/52
Inventor 孙丽丽肖永龙胡新星
Owner NEW FOUNDER HLDG DEV LLC
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