Crystal silicon and silicon carbide film compound unijunction PIN solar battery with transition layer, and preparation method thereof
A solar cell and transition layer technology, which is applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems that no one has developed a single-junction PIN solar cell manufacturing method, and no one has developed a thin-film solar cell manufacturing technology.
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Embodiment 1
[0077] Crystalline silicon and silicon carbide film composite single-junction PIN solar cells with a transition layer structure, selected from one of the following solar cell structures:
[0078] 1) Bottom electrode / n layer / n-type silicon wafer / transition layer / i-A-SiC layer / p-A-SiC layer / TCO / anti-reflection film;
[0079] 2) Bottom electrode / n layer / n-type silicon wafer / transition layer / i-μc-SiC layer / i-A-SiC layer / p-A-SiC layer / TCO / anti-reflection film;
[0080] 3) Bottom electrode / n layer / n-type silicon wafer / transition layer / p-A-SiC layer / TCO / anti-reflection film;
[0081] 4) Bottom electrode / n layer / transition layer / n-type silicon wafer / i-A-SiC layer / p-A-SiC layer / TCO / anti-reflection film;
[0082] 5) Bottom electrode / n layer / transition layer / n-type silicon wafer / i-μc-SiC layer / i-A-SiC layer / p-A-SiC layer / TCO / anti-reflection film;
[0083] 6) Bottom electrode / n layer / transition layer / n-type silicon wafer / p-A-SiC layer / TCO / anti-reflection film;
[0084] 7) Bottom electr...
Embodiment 2
[0093] The manufacturing method of the transition layer, such as figure 2 shown, including the following methods:
[0094]The first type: After preliminary cleaning, chemical texturing, chemical or mechanical double-sided polishing of the n-type silicon wafer, the n-type silicon wafer is cleaned again, and the cleaned silicon wafer is pre-hydrogenated and dried. The treatment method is as follows: : Send the silicon wafer to the equipment with a closed chamber, evacuate the atmosphere until the chamber pressure is less than or equal to (≤) 1Pascal; the chamber temperature is controlled between 30°C and 350°C, and hydrogen or a mixture of hydrogen and nitrogen is introduced gas; dry silicon wafers under a hydrogen atmosphere. The purity of hydrogen and nitrogen is greater than or equal to (≥) 99.99%; if a mixed gas is used, the volume ratio of hydrogen and nitrogen is 0.1 to 100 times; the hydrogenation drying time is 1 to 60 minutes. Send the hydrogenated and dried silicon ...
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