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Lead-free and halogen-free soldering paste for semiconductors

A solder paste and semiconductor technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems that cannot meet the requirements of miniaturization, multi-function, high integration, harmlessness, activation point and electronic products. Soldering temperature mismatch, poor carrier rheology, etc., to achieve good rheological resistance, increase strength, and prolong service life

Inactive Publication Date: 2015-04-01
瑞乾电子科技(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are common problems in solder paste, such as poor rheology of carrier, dry paste, mismatch between activation point and soldering temperature, and large residue after soldering. The existence of these problems cannot meet the requirements of miniaturization and multi-function of electronic products. Requirements for various performances such as modernization, high integration, and harmlessness

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Solder paste is made by mixing 16 parts flux and 84 parts SnAgCu series solder powder. Among them, the SnAgCu series solder powder is composed of 96.5% Sn powder, 3% Ag powder and 0.5% Cu powder, that is, 81.1 parts of Sn powder, 2.5 parts of Ag powder, and 0.4 parts of Cu powder.

[0016] The flux is composed of 34% liquid rosin, 8% activator, 42% organic solvent and 16% thixotropic agent. That is, rosin: 5.4 parts, n-valeric acid: 1.3 parts, neopentyl glycol: 6.7 parts, hydrogenated castor oil: 2.6 parts.

Embodiment 2

[0018] Solder paste is made by mixing 20 parts flux and 80 parts SnAgCu series solder powder. Among them, the SnAgCu series solder powder is composed of 96% Sn powder, 3.5% Ag powder and 0.5% Cu powder, that is, 76.8 parts of Sn powder, 2.8 parts of Ag powder and 0.4 part of Cu powder.

[0019] The flux is made of 34% fully hydrogenated rosin, 8% active agent, 42% organic solvent and 16% polyamide wax modified hydrogenated castor oil. That is, rosin: 6.8 parts, adipic acid: 1.6 parts, ethylene glycol phenyl ether: 8.4 parts, thixotropic agent: 3.2 parts.

Embodiment 3

[0021] The solder paste is made by mixing 18 parts flux and 82 parts SnAgCu series solder powder. Among them, the SnAgCu series solder powder is composed of 96.5% Sn powder, 3% Ag powder and 0.5% Cu powder, that is, 79.1 parts of Sn powder, 2.5 parts of Ag powder and 0.4 parts of Cu powder.

[0022] The flux is composed of 38% polymerized rosin, 13% activator, 39% organic solvent and 10% thixotropic agent. That is, rosin: 6.8 parts, maleic acid: 2.4 parts, diethylene glycol monohexyl ether: 7 parts, ethylene bisstearic acid amide: 2.6 parts.

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PUM

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Abstract

The invention discloses a lead-free and halogen-free soldering paste for semiconductors. The soldering paste is formed by mixing, by mass, 15% to 20% of flux and 80% to 85% of SnAgCu serial solder powder. The flux comprises components of, by mass, 30% to 38% of rosin, 6% to 14% of active agents, 33% to 34% of organic solvents and 7% to 16% of thixotropic agents. By means of the flux, the welding spot strength is improved, the service life is prolonged, the problems of dry soldering paste, poor rheological property and few residues are solved; the welding performance, the printing performance and the spreadability of the soldering paste are good.

Description

technical field [0001] The invention relates to a solder paste for the electronic industry, in particular to a lead-free and halogen-free solder paste for the electronic industry. Background technique [0002] In recent years, computers, communication equipment, instruments and meters, and household appliances have developed towards miniaturization, high performance, and multi-purpose. The development of surface mount technology is due to the emergence of microelectronic components and high-precision fine electronic integrated chips. The welding method and required welding materials of surface mount technology have also changed, and the raw material solder paste used in the surface mount technology industry has become more and more widely used, and has been increasingly valued by the electronics manufacturing industry. [0003] Solder paste is a solder material used in reflow soldering of electronic printed circuit boards. It is made by mixing and stirring solder powder and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/362B23K35/3612
Inventor 陈井山
Owner 瑞乾电子科技(苏州)有限公司
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