Flexible electronic fluid encapsulation method capable of improving ductility

Abstract

The invention discloses a flexible electronic fluid encapsulation method capable of improving ductility. The flexible electronic fluid encapsulation method comprises the following steps: preparing an upper encapsulation structure and a lower encapsulation structure, wherein the two encapsulation structures are symmetrical and areas concavely extending are formed in central parts of the encapsulation structures; manufacturing a ductility interconnection structure which is of a curve structure with overall wavy distribution; correspondingly laminating the upper encapsulation structure and the lower encapsulation structure, and encapsulating the ductility interconnection structure in a hollow micro cavity; and finally, injecting insulation fluid into the micro cavity so that the micro cavity is filled with the insulation fluid and the ductility interconnection structure is coated, and therefore, the overall fluid encapsulation operation is completed. By virtue of the flexible electronic fluid encapsulation method capable of improving ductility, the tensile property of the interconnection structure can be remarkably improved; the phenomenon that the surface warps outwards is avoided; the quality can be controlled; meanwhile, the stability of the interconnection structure can be effectively improved.

Description

technical field [0001] The invention belongs to the technical field of flexible electronics manufacturing, and more specifically relates to a flexible electronic fluid packaging method that can improve ductility. Background technique [0002] Flexible electronics is an emerging electronic technology that manufactures electronic devices on flexible or ductile plastic or thin metal substrates. , national defense and many other fields have broad application prospects. At present, for the flexible electronic interconnection structure, the preparation process adopted is mainly to use the printing method to directly print the flexible interconnection structure on the elastic substrate, and fix it with the elastic substrate through the adhesive layer. The problem with this method is that the incompatibility of the flexible interconnect structure with the adhesive layer and the substrate will affect the tensile properties of the interconnect structure, and during the stretching pro...

AI Technical Summary

Problems solved by technology

The problem with this method is that the incompatibility of the flexible interconnect structure with the adhesive layer and the substrate will affect the tensile properties of the interconnect structure, and during the stretching process, the stretchability of the interconnect structure is affected by the adhesive. Adhesive layer and substrate bound and not fully applied

[0004] However, further studies have shown that the above existing technologies still have the following problems: 1) the interconnection structure used is prone to out-of-plane buckling, and it is difficult to guarantee the deformation mode of the interconnection structure during stretching; 2) lack of In-depth research on the relationship between the suspension medium and the packaging structure, the performance of the final packaging structure still needs to be improved; 3) The interconnection structure and the triangular-conical boss structure used need to be made by photolithography and other processes. complicated and costly

Images