Equipment and method for processing and cutting solar silicon wafers

Abstract

The invention belongs to the field of slicing of solar photovoltaic wafers and solar slicing machines, and particularly relates to a device and method for slicing solar silicon wafers. The device is used for cutting silicon blocks into silicon wafers in the solar cell producing process. A slicing machine achieves slicing through a steel wire and slurry. A wire net is arranged on a guide wheel of the silicon wafer slicing machine, and a sand blasting nozzle workpiece, a platform clamping workpiece and the like are arranged on the wire net. A silicon block is arranged on a clamping tool, and a slurry pump motor guides slurry in a slurry tank to the wire net on the guide wheel, so that the slurry makes contact with the silicon block, and the silicon block is cut to silicon wafers. A semicircular floating drum of a fixed volume is additionally arranged in an original slurry tank, the volume of the whole slurry tank is reduced, the liquid level of the slurry in the slurry tank is increased, normal operation of the device is guaranteed, and the purpose of reducing slurry consumption to save cost is achieved.

Description

technical field [0001] The invention belongs to the field of solar photovoltaic slicing processing, in particular to a novel solar silicon chip processing and cutting device and method, and belongs to the field of solar slicing machines. Background technique [0002] With the rapid development of the photovoltaic industry, the number of solar silicon wafer cutting equipment is increasing significantly every year. Among them, the demand for cutting mortar for cutting equipment has exceeded 1,500 tons per day. The competitive pressure of the international market has forced more and more silicon wafer cutting companies to reduce production costs and improve the high-quality rate of silicon wafer cutting to improve competitiveness and viability. At present, the process and operation process of silicon wafer cutting in various companies are roughly the same. How to achieve better benefits under the same process and process requires attention to details, making improvements in sm...

AI Technical Summary

Problems solved by technology

In the existing slicer silicon wafer wire cutting, nearly 35--45% of the silicon material is cut into fine powder and a small amount of iron fine powder worn by the steel wire enters the circulating mortar system together with the cutting mortar, and a large amount of fine powder adheres to the The silicon carbide surface participates in the cutting together with the mortar, resulting in an increase in the density and viscosity of the mortar, which affects the cutting ability of the mortar and decreases with the increase of the cutting time. The user can only replace the waste mortar with a new one after each cut. And to compensate for changes in mortar density, a large amount of available mortar becomes waste mortar together, which increases the cost of mortar replacement and equipment maintenance costs

Images