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Magnetic sensor and preparation technology thereof

A technology of magnetic sensor and preparation process, which is applied in the field of preparation of three-axis magnetic sensor, sensor, and three-axis magnetic sensor, and can solve the problem of inability to manufacture the slit of the magnetic conduction unit and the induction unit, affect the photolithography, and prevent the exposure of the photoresist and other issues to achieve the effects of sensitivity improvement, performance optimization, and process simplification

Inactive Publication Date: 2015-03-18
QST CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the existence of grooves poses a great challenge to the existing photolithography process: after the glue is thrown, the groove area will be uneven, and after the photoresist is spin-coated, grooves will appear in the groove area, which seriously affects the lithography process. , that is, the slit between the magnetic conduction unit and the sensing unit cannot be made, and the photoresist at the bottom of the trench cannot be exposed

Method used

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  • Magnetic sensor and preparation technology thereof
  • Magnetic sensor and preparation technology thereof
  • Magnetic sensor and preparation technology thereof

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Embodiment 1

[0055] The present invention discloses a preparation process of a magnetic sensor. The preparation process includes the preparation process of a third-direction magnetic sensor device, which specifically includes the following steps:

[0056] [Step S1] A dielectric material is deposited on the substrate, such as silicon oxide, TEOS, silicon nitride, silicon oxynitride, etc., to form the first dielectric layer 10;

[0057] [Step S2] Please refer to Image 6 , An array of trenches 11 is formed on the first dielectric layer 10. In this embodiment, the width of the trench 11 is greater than half of the depth. The width of the opening of the trench 11 is greater than half of the depth; preferably, the width of the bottom of the trench 11 is greater than half of the depth of the trench.

[0058] [Step S3] Deposit the same or different second dielectric material on the above dielectric material (including trench), such as silicon oxide, TEOS, silicon nitride, tantalum oxide, tantalum nitri...

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Abstract

The invention discloses a magnetic sensor and a preparation technology thereof. The preparation technology comprises the following steps of depositing medium material on a substrate to form a first medium layer; forming a groove array on the first medium layer; enabling the width of an opening of a groove to be greater than the depth; depositing magnetic material to form a magnetic material layer; annealing in a magnetic field, wherein an annealing atmosphere is nitrogen, or inert gas or vacuum; preparing filling material, forming a filling material layer, filling the groove, and performing the photoetching technology; generating a pattern of the magnetic sensor, forming a sensing unit, and forming a magnetic conduction unit by using the groove, namely forming a three-axis sensor on a single chip; manufacturing a through hole and an electrode. The three-axis sensor and the preparation technology have the advantages that the technology process can be optimized, and the property of the sensor is improved.

Description

Technical field [0001] The invention belongs to the technical field of semiconductor technology, and relates to a sensor, in particular to a three-axis magnetic sensor; at the same time, the invention also relates to a preparation process of the three-axis magnetic sensor. Background technique [0002] According to their principles, magnetic sensors can be divided into the following categories: Hall elements, magneto-sensitive diodes, anisotropic magnetoresistive elements (AMR), tunnel junction magnetoresistance (TMR) elements and giant magnetoresistance (GMR) elements, induction coils , Superconducting quantum interference magnetometer, etc. [0003] Electronic compass is one of the important application areas of magnetic sensors. With the rapid development of consumer electronics in recent years, in addition to navigation systems, more and more smart phones and tablet computers have also begun to provide electronic compasses as standard, bringing users With great application con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R33/09
Inventor 张挺杨鹤俊
Owner QST CORP
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