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Anti-dropping bonding pad, circuit board, and circuit board printing method

A circuit board, anti-falling technology, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problem of pad falling off, achieve the effect of not easy to fall off, increase the fixed area, and increase the difficulty

Inactive Publication Date: 2015-03-11
QINGDAO GOERTEK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the existing pads are easy to fall off from the circuit board, the present invention proposes an anti-falling pad, which is more firmly attached and not easy to fall off

Method used

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  • Anti-dropping bonding pad, circuit board, and circuit board printing method
  • Anti-dropping bonding pad, circuit board, and circuit board printing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Embodiment 1, this embodiment proposes an anti-shedding pad, such as figure 1 As shown, it includes copper foil 11 mounted on the circuit board base material, the copper foil 11 is electrically connected with the circuit traces arranged on the circuit board base material, and the copper foil 11 includes a central solder resist located in the central area layer 110 and an oil-coated layer 111 located in the outer edge region, the upper surface of the oil-coated layer 111 is coated with a green oil layer. The anti-shedding pad of this embodiment divides the entire copper foil 11 into a central solder resist layer 110 located in the central area and an oil-coated layer 111 located in the outer edge area, and the upper surface of the oil-coated layer 111 is coated with a green oil layer (The reason for the angle is not shown in the figure). On the one hand, in order to meet the function of the pad, it is ensured that the exposed part of the copper foil (that is, the central...

Embodiment 2

[0026] Embodiment 2, based on the anti-shedding pad in Embodiment 1, this embodiment proposes a circuit board, such as figure 2 As shown, it includes a circuit board base material 13, a circuit trace 14, and a pad electrically connected to the circuit trace 14, and the pad includes a copper foil 11 mounted on the circuit board base material, so The copper foil 11 includes a central solder resist layer 110 located in the central area and an oil-coated layer 111 located in the outer edge area, and the upper surface of the oil-coated layer 111 is coated with a green oil layer. like figure 2 As shown in , the pad is an independent copper foil 11 in the circuit board base material 13, and the surrounding area of ​​the copper foil 11 is a clearance area 15, which is used to isolate the copper foil 11 from other copper areas on the circuit board, and the clearance The upper surface of the area 15 is also coated with a green oil layer. Therefore, it is preferable that the green oil...

Embodiment 3

[0030] Embodiment 3, based on a circuit board in Embodiment 2, this embodiment proposes a circuit board printing method. This circuit board printing method includes the step of attaching pads. The schematic structural diagram of the circuit board is as follows figure 2 As shown, the pad includes copper foil 11, and the step of attaching the pad includes:

[0031] S1. Mount the copper foil 11 on the circuit board substrate 13, and electrically connect the copper foil 11 to the circuit trace 14;

[0032] S2. The copper foil 11 includes a central solder resist layer 110 located in the central area and an oil-coated layer 111 located in the outer edge area, and the surface of the oil-coated layer 111 together with the clearance area 15 around the copper foil 11 is coated with green oil layer.

[0033]In this embodiment, by coating the surface of the oil-coated layer 111 together with the clear area 15 around the copper foil 11 with a green oil layer, the formed green oil layer h...

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Abstract

The invention discloses an anti-dropping bonding pad, a circuit board, and a circuit board printing method, wherein the anti-dropping bonding pad comprises copper foil adhered to a base material of the circuit board, the copper foil is electrically connected with a wire route on the base material of the circuit board, the copper foil comprises a central solder mask layer in the central area and an oil coating layer in the peripheral area, and the upper surface of the oil coating layer is coated with a green oil layer. The anti-dropping bonding pad divides the whole copper foil into the central solder mask layer in the central area and the oil coating layer in the peripheral area, and the upper surface of the oil coating layer is coated with the green oil layer, so that on the one hand, the fixing area of the bonding pad and the base material of the circuit board is increased, when an upward-pulling external force is applied to the bonding pad, the force in a unit area is dispersed, the bonding pad is not easily pulled up, on the other hand, the green oil layer has a pressing force on the copper foil, so that the difficulty of pulling up the bonding pad is further increased, and the bonding pad does not fall off easily in the operation process.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to an anti-falling pad, a circuit board, and a circuit board printing method. Background technique [0002] PCB (Printed Circuit Board) often uses test points during production and debugging. During analysis such as software programming and debugging, it often needs to be debugged through the pad leads at the test points. If you use it carelessly, you will often encounter the entire pad. If the copper skin is pulled out, if the pad is led out from the source of the chip, basically the entire circuit board will be scrapped, which is high risk and wastes resources, increases the difficulty of production and debugging, and is not conducive to reducing costs. Contents of the invention [0003] In order to solve the problem that the existing welding pads are easy to fall off from the circuit board, the present invention proposes an anti-falling-off welding pad, which...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/116H05K3/28H05K2201/09372H05K2203/03
Inventor 邓雪冰
Owner QINGDAO GOERTEK
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