Deep curable and highly transparent condensation-type silicone potting glue, preparation method and application thereof
A deep curing and condensation-type technology, applied in the direction of chemical instruments and methods, non-polymer adhesive additives, adhesives, etc., can solve the problems of limited application, influence, poor performance, etc., and achieve convenient operation, simple production process, Excellent weather resistance
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Embodiment 1
[0025] 1. In this embodiment, a highly transparent condensation-type silicone encapsulant that can be deeply cured is formed by mixing component A and component B; the raw material compositions of component A and component B are as follows in parts by weight:
[0026] Component A:
[0027]
[0028] Component B:
[0029]
[0030] *The deep curing agent amphiphilic emulsion is octadecyl dihydroxyethyl amine oxide;
[0031] **The coupling agent is: a mixture of γ-aminopropyltriethoxysilane:Y-(2,3-glycidoxy)propyltrimethoxysilane=1:3 by weight.
[0032] 2. The preparation method of a highly transparent condensation-type silicone potting compound capable of deep curing in this embodiment is as follows:
[0033] Preparation of component A:
[0034] Stir and mix the raw materials of the above-mentioned component A for 20 minutes at normal pressure with a stirring speed of 25 Hz and a dispersion speed of 25 Hz to obtain component A;
[0035] Preparation of component B:
[0...
Embodiment 2
[0038] 1. In this embodiment, a highly transparent condensation-type silicone encapsulant that can be deeply cured is formed by mixing component A and component B; the raw material compositions of component A and component B are as follows in parts by weight:
[0039] Component A:
[0040]
[0041]
[0042] Component B:
[0043]
[0044] 2. The preparation method of a highly transparent condensation-type silicone potting compound capable of deep curing in this embodiment is as follows:
[0045] Preparation of component A:
[0046] Stir and mix the raw materials of the above-mentioned component A for 25 minutes at normal pressure with a stirring speed of 5 Hz and a dispersion speed of 15 Hz to obtain component A;
[0047] Preparation of component B:
[0048] Stir and mix the raw materials of the above-mentioned component B under nitrogen protection for 10 minutes to obtain the component B.
Embodiment 3
[0050] 1. In this embodiment, a highly transparent condensation-type silicone encapsulant that can be deeply cured is formed by mixing component A and component B; the raw material compositions of component A and component B are as follows in parts by weight:
[0051] Component A:
[0052]
[0053] Component B:
[0054]
[0055] 2. The preparation method of a highly transparent condensation-type silicone potting compound capable of deep curing in this embodiment is as follows:
[0056] Preparation of component A:
[0057] Stir and mix the raw materials of the above-mentioned component A for 25 minutes at normal pressure with a stirring speed of 2 Hz and a dispersion speed of 35 Hz to obtain component A;
[0058] Preparation of component B:
[0059] Stir and mix the raw materials of the above-mentioned component B under nitrogen protection for 15 minutes to obtain the component B.
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