Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of ultraviolet cured silicon-containing acrylate conductive printed adhesive

A technology of silicon acrylate and ultraviolet light, which is applied in the direction of conductive adhesives, adhesives, non-polymer organic compound adhesives, etc., can solve the problem of degrading the releasability of embossing adhesives, adhesion and contact between embossing adhesives and templates Area increase and other problems, to achieve the effect of reducing surface energy, reducing viscosity, and low production cost

Inactive Publication Date: 2015-01-28
SHANDONG UNIV OF SCI & TECH
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the effect of this method is not ideal in the actual use process. After repeated embossing, the releasability of the embossing adhesive deteriorates.
In particular, when forming a pattern with a high aspect ratio, the contact area between the template and the embossing glue increases, and the phenomenon of sticking of the embossing glue and the template often occurs, resulting in defects in the pattern

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of ultraviolet cured silicon-containing acrylate conductive printed adhesive
  • Preparation method of ultraviolet cured silicon-containing acrylate conductive printed adhesive
  • Preparation method of ultraviolet cured silicon-containing acrylate conductive printed adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Use wet ball milling to process copper powder, add absolute ethanol to the copper powder as a medium, and use a planetary ball mill for ball milling under nitrogen protection, and grind for 20 hours to obtain flake copper powder with pearlescent color and a particle size of 1-10 microns ;

[0051] Wash the above flaky copper powder three times with a dilute sulfuric acid solution with a concentration of 5%, and then wash it three times with absolute ethanol. After filtering, add a dispersant or a coupling agent to the filter residue, quickly put it in a vacuum drying oven, and dry it for later use. ;

[0052] According to the number of parts by mass, mix 163 parts of trimethylchlorosilane and 62 parts of KH-550, and evenly drop a mixed solution of 40.8 parts of deionized water and 48 parts of methanol within 30 minutes, and stir until uniform; the reaction temperature is controlled Below 50°C;

[0053] After continuing to stir at room temperature for 12 hours, the org...

Embodiment 2

[0059] Use wet ball milling to process copper powder, add absolute ethanol to the copper powder as a medium, and use a planetary ball mill for ball milling under nitrogen protection, and grind for 20 hours to obtain flake copper powder with pearlescent color and a particle size of 1-10 microns ;

[0060] Wash the above flaky copper powder three times with a dilute sulfuric acid solution with a concentration of 5%, and then wash it three times with absolute ethanol. After filtering, add a dispersant or a coupling agent to the filter residue, quickly put it in a vacuum drying oven, and dry it for later use. ;

[0061] According to the number of parts by mass, mix 163 parts of trimethylchlorosilane and 62 parts of KH-550, and evenly drop a mixed solution of 40.8 parts of deionized water and 48 parts of methanol within 30 minutes, and stir until uniform; the reaction temperature is controlled Below 50°C;

[0062] After continuing to stir at room temperature for 12 hours, the org...

Embodiment 3

[0068] Use wet ball milling to process copper powder, add absolute ethanol to the copper powder as a medium, and use a planetary ball mill for ball milling under nitrogen protection, and grind for 20 hours to obtain flake copper powder with pearlescent color and a particle size of 1-10 microns ;

[0069] Wash the above flaky copper powder three times with a dilute sulfuric acid solution with a concentration of 5%, and then wash it three times with absolute ethanol. After filtering, add a dispersant or a coupling agent to the filter residue, quickly put it in a vacuum drying oven, and dry it for later use. ;

[0070] According to the number of parts by mass, mix 163 parts of trimethylchlorosilane and 62 parts of KH-550, and evenly drop a mixed solution of 40.8 parts of deionized water and 48 parts of methanol within 30 minutes, and stir until uniform; the reaction temperature is controlled Below 50°C;

[0071] After continuing to stir at room temperature for 12 hours, the org...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle size (mesh)aaaaaaaaaa
shear strengthaaaaaaaaaa
shear strengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a preparation method of an ultraviolet cured silicon-containing acrylate conductive printed adhesive. The adhesive is mainly prepared by synthesizing a silicon-containing acrylate resin substrate through a one-step process based on trimethyl chlorosilane and KH-550 as main raw materials and mixing the silicon-containing acrylate resin substrate with copper powder which is used as a conductive filler after wet milling, an active diluting agent vinyl pyrrolidone (NVP), a curing agent trihydroxymethyl propane triacrylate (TMPTA), a photoinitiator and the like. The preparation method of the conductive printed adhesive disclosed by the invention is simple and easy to control in process; and the prepared conductive printed adhesive has a good demoulding performance and dry etching resistance, and can replace a conventional Pb-Sn solder as a novel environment-friendly microelectronic packaging interconnection material.

Description

technical field [0001] The invention relates to a preparation method of a conductive embossing adhesive, in particular to a preparation method of an ultraviolet light curing silicon-containing acrylate type conductive embossing adhesive. Background technique [0002] With the development of imprinted composite materials, UV imprinting technology has gradually been widely used. The UV imprinting process uses a transparent template and a photopolymerizable compound. The main process is generally: first spray an organic polymer solution (transfer layer) on the substrate, and then spin coat (or drop) on the transfer layer A very thin layer of low-viscosity monomer solution (imprinting layer) is imprinted under certain temperature and pressure conditions. After the monomer is completely filled with the template gap, ultraviolet light is irradiated through the back of the template to polymerize the monomer, and it is removed after curing. The pattern is removed by dry etching to ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06C09J9/02
Inventor 李廷希苏海波高丽王延敏王清崔洪芝
Owner SHANDONG UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com