Method for preventing shedding of welding rings in printed circuit board and printed circuit board

A technology of printed circuit boards and soldering rings, which is applied in the direction of printed circuits, printed circuits, printed circuit components, etc., and can solve problems such as heavy weight of transformers or common mode inductors, large pad stress, permanent damage to PCBs, etc.

Inactive Publication Date: 2015-01-21
SHENZHEN GONGJIN ELECTRONICS CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the size of the pad is usually designed according to certain rules, resulting in limited adhesion of the pad
[0003] Due to the heavy weight of the transformer or common mode inductor, the pad will be under great stress when the external force impacts, which may cause the soldering ring to separate from the PCB substrate, resulting in permanent damage to the PCB

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preventing shedding of welding rings in printed circuit board and printed circuit board
  • Method for preventing shedding of welding rings in printed circuit board and printed circuit board
  • Method for preventing shedding of welding rings in printed circuit board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] In order to make the objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0020] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0021] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for preventing shedding of welding rings in a printed circuit board. The method comprises the following steps that a substrate is provided; holes are drilled on the substrate; a copper foil is formed on the substrate; the welding rings enclosing the through holes are formed on the positions, which are arranged at the periphery of the through holes, of the substrate; a green oil layer is formed on the surface of the copper foil; windowing is performed on the green oil layer so that multiple reinforced windows are formed, and width of each reinforced window gradually narrows from the welding rings to the outside; and tin claws, which are similar to the shape of the reinforced windows, are formed at the reinforced windows after wave peak welding. The invention also discloses the printed circuit board. Surface area of the welding rings is increased so that adhesive force of the welding rings to the substrate is increased, and the risk of separation of the welding rings of pins of heavier devices from base material when the PCB is impacted by external force is greatly reduced.

Description

technical field [0001] The invention relates to the field of printed circuits, in particular to a method for preventing welding rings in a printed circuit board from falling off, and also to a printed circuit board. Background technique [0002] For single-sided power boards, relatively heavy components such as transformers, common mode inductors, etc. are completely dependent on the solder pads (composed of drilled holes and solder rings surrounding the drilled holes) to be fixed on the printed circuit board (PCB). However, the size of the pad is usually designed according to certain rules, resulting in limited adhesion of the pad. [0003] Due to the heavy weight of the transformer or common-mode inductor, the pad will be under great stress when the external force impacts, which may cause the soldering ring to separate from the PCB substrate, resulting in permanent damage to the PCB. Contents of the invention [0004] Based on this, it is necessary to provide a method f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40H05K1/11
CPCH05K1/115H05K3/40H05K2201/09381H05K2201/09418
Inventor 王达国
Owner SHENZHEN GONGJIN ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap