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Preparation method of polyphenyl ether adhesive and copper-clad plate thereof

A polyphenylene ether and adhesive technology, applied in polyether adhesives, adhesives, adhesive additives, etc., can solve problems such as high melting temperature, limited application, and poor melt fluidity

Active Publication Date: 2015-01-07
SICHUAN DONGFANG INSULATING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high melting temperature, high melt viscosity and poor melt fluidity of the existing polyphenylene ether resin, it is not conducive to the preparation of printed circuit boards, thus limiting its application in high-performance printed circuit boards

Method used

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  • Preparation method of polyphenyl ether adhesive and copper-clad plate thereof
  • Preparation method of polyphenyl ether adhesive and copper-clad plate thereof
  • Preparation method of polyphenyl ether adhesive and copper-clad plate thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0056] Preparation of modified low molecular weight polyphenylene ether resin:

[0057] Modified low molecular weight polyphenylene ether resin Ⅰ

[0058] First, add 100 kg of polyphenylene ether (Asahi Kasei Chemical Co., Ltd., trade name S201A, number average molecular weight is 20,000) in a non-airtight reactor A equipped with a reflux condenser, stirring, and a thermocouple, and add 240 kg of toluene As a solvent, raise the temperature to 90°C and stir to dissolve the polyphenylene ether particles completely, then add 15.5kg of diallyl bisphenol A, at 55°C, add 3.2kg of benzoyl peroxide, add in 6 times within 0.5h Complete, stop reaction after reacting 3h. Second, add 2.2kg of sodium hydroxide and 1kg of tetrabutylammonium bromide to reactor A, add 30kg of 3-chloropropene dropwise at a temperature of 50°C, drop it for 1 hour, and continue the reaction at this temperature After 8 hours, the reaction solution of allylated polyphenylene ether resin was obtained. Thirdly, d...

Embodiment 1

[0067] Take 100 kg of resin composition at room temperature (50 kg of the above-mentioned modified low molecular weight polyphenylene ether resin I, 29.4 kg of Dow 383 epoxy resin, 16 kg of bisphenol A benzoxazine resin, 4.6 kg of bismaleimide resin ㎏), 25 kg of magnesium hydroxide, 70 kg of toluene and 23 kg of methyl ethyl ketone were added to the plastic mixing tank, stirred for 1 hour, added 1.3 kg of imidazole, stirred at room temperature for 1 hour, and the molding time of the round hole method was 272 seconds under a hot plate at 171 °C. That is, the preparation of the polyphenylene ether adhesive is completed.

[0068] The glass fiber cloth 2116 is coated with polyphenylene ether adhesive through the gluing machine. The length of the drying channel of the gluing machine is 24m, divided into 3 sections, each section is 8m, and the baking temperature ranges from 70°C to 165°C. ℃, the speed (line speed) of the gluing machine is 2-10m / min, after the glass fiber cloth coate...

Embodiment 2

[0070]Take 100 kg of resin composition at room temperature (50 kg of the above-mentioned modified low molecular weight polyphenylene ether resin II, 26.8 kg of Dow 383 epoxy resin, 18 kg of bisphenol A benzoxazine resin, 5.2 kg of bismaleimide resin ㎏), talcum powder 26㎏, toluene 70㎏ and methyl ethyl ketone 23㎏ were added to the plastic mixing tank, stirred for 2 hours, added 1.3kg of triphenylphosphine, stirred at room temperature for 1 hour, and the molding time of the round hole method under a hot plate at 171°C was In 291 seconds, the preparation of the polyphenylene ether adhesive is completed.

[0071] The glass fiber cloth 2116 is coated with polyphenylene ether adhesive through the gluing machine. The length of the drying channel of the gluing machine is 24m, divided into 3 sections, each section is 8m, and the baking temperature ranges from 70°C to 165°C. ℃, the speed (line speed) of the gluing machine is 2-10m / min, after the glass fiber cloth coated with the polyphen...

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Abstract

The invention discloses a polyphenyl ether adhesive. The adhesive is characterized by being prepared by mixing the following raw materials in parts by mass: 100 parts of a resin composition, 0-15 parts of a flame retardant, 20-30 parts of a powder material, 0.1-2 parts of a curing accelerator and 50-100 parts of a solvent, wherein the resin composition is prepared by mixing the following raw materials in parts by mass: 20-65 parts of modified low-molecular weight polyphenyl ether resin, 15-40 parts of epoxy resin, 20-40 parts of benzoxazine resin and 3-9 parts of bismaleimide resin. The adhesive is prepared by the following steps: preparing the modified low-molecular weight polyphenyl ether resin, preparing the resin composition, preparing the polyphenyl ether adhesive and the like. The copper-clad plate is prepared by the steps of preparing a polyphenyl ether glass fiber cloth prepreg from the polyphenyl ether adhesive by application of a gluing machine, and preparing the copper-clad plate by a vacuum press. The copper-clad plate prepared by the method has excellent dielectric property.

Description

technical field [0001] The invention belongs to an adhesive and its preparation and application, and relates to a polyphenylene ether adhesive, a preparation method thereof, and a preparation method for a copper-clad laminate. The polyphenylene ether adhesive of the invention is suitable for use as an adhesive for prepregs and copper-clad laminates in electrical and electronic products, and the copper-clad laminate prepared by using the adhesive of the invention has good dielectric properties. Background technique [0002] With the rapid development of the information industry, higher requirements are put forward for the substrate materials used in printed circuit boards, which require lower dielectric constant and dielectric loss, high glass transition temperature, high heat resistance, low water absorption. Traditional epoxy laminates can no longer meet the requirements of electronic printed circuit boards, and it is necessary to find a matrix resin with better performanc...

Claims

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Application Information

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IPC IPC(8): C09J171/12C09J163/00C09J163/04C09J179/04C09J179/08C09J11/04C09J11/06C08G65/48B32B15/08B32B15/092B32B27/04B32B37/06B32B37/10H05K1/03
Inventor 代三威黄杰吴学明
Owner SICHUAN DONGFANG INSULATING MATERIAL
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