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Polyamic acid solution composition and polyimide

A technology of polyamic acid and polyimide, which is applied in the field of polyamic acid solution composition, can solve the problems such as the decrease of polyimide transmittance, and achieve the effect of high transparency and excellent transparency

Active Publication Date: 2014-12-24
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method may lower the transmittance of the polyimide obtained by thermally decomposing the aminopropyl group during thermal imidization.

Method used

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  • Polyamic acid solution composition and polyimide
  • Polyamic acid solution composition and polyimide
  • Polyamic acid solution composition and polyimide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0087] Hereinafter, the present invention will be described in more detail using examples. It should be noted that the present invention is not limited to the following examples.

[0088] The abbreviations of the compounds used in the following examples are as follows.

[0089] 6FDA: 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride

[0090] 2,2'-TFMB: 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl

[0091] 6FAP: 2,2'-bis(3-amino-4-hydroxyphenyl)hexafluoropropane

[0092] The property measurement methods used in the following examples are as follows.

[0093] (solid content concentration)

[0094] The solid content concentration of the polyamic acid solution is to dry the polyamic acid solution at 350°C for 30 minutes, and use the following formula according to the weight W before drying 1 and dry weight W 2 The value obtained.

[0095] Solid content concentration (weight %)=(W 2 / W 1 )×100

[0096] (log viscosity)

[0097] The sample solution was diluted so...

reference example 1

[0104] Add 440 g of N-methyl-2-pyrrolidone as a solvent to a glass reaction vessel with a 500-ml internal volume equipped with a stirrer and a nitrogen gas introduction and discharge pipe, and add 2,2'-TFMB 25.12 g (0.0785 mol) and 6FDA34 .88g (0.0785 mol), stirred at 50°C to obtain a polyamic acid solution with a solid content concentration of 11.43% and a logarithmic viscosity of 0.60.

Embodiment 1

[0108] To the polyamic acid solution obtained in Reference Example 1 was added a colloidal solution obtained by dispersing colloidal silica in N,N-dimethylacetamide (manufactured by Nissan Chemical Industries, Ltd., DMAc-ST; silica particles Solid content concentration: 20 wt %; particle size of silicon dioxide: 10 to 20 nm) 6 g and stirred to obtain a polyamic acid solution composition. The amount of silica added was 2 parts by mass relative to 100 parts by mass of the monomer component (6FDA+2,2'-TFMB).

[0109] The polyamic acid solution composition is coated on the glass plate of the base material by a bar coater, and the coating film is heat-treated at 120°C for 60 minutes, 150°C for 30 minutes, 200°C for 30 minutes, and 400°C for 1 minute. A polyimide film with a thickness of 10 μm was formed on the plate.

[0110] Then, the polyimide film was peeled off from a glass plate, and the linear expansion coefficient and light transmittance of this polyimide film were measured...

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Abstract

The present invention relates to a polyamic acid solution composition, which is obtained by reacting a tetracarboxylic acid component comprising at least 50 mol% of a fluorine atom-containing tetracarboxylic dianhydride and a diamine component comprising at least 50 mol% of a fluorine atom-containing diamine in a solvent and adding to the resulting polyamic acid solution a colloidal solution of colloidal silica dispersed in an organic solvent such that the amount of the silica is 1 to 100 parts by mass per a total of 100 parts by mass of the tetracarboxylic acid component and the diamine component.

Description

technical field [0001] The present invention relates to a polyamic acid solution composition, which can obtain a polyimide with excellent transparency and a low coefficient of linear expansion (CTE), especially at high temperatures. Background technique [0002] Polyimides obtained from tetracarboxylic dianhydrides and diamines are widely used in electrical and electronic industries due to their excellent properties such as heat resistance, mechanical strength, electrical properties, and solvent resistance. However, since polyimide is poorly soluble in organic solvents, it is common to apply a solution composition (polyamic acid solution composition) of a polyamic acid in which a polyimide precursor is dissolved in a solvent, for example, to a substrate. On the surface of the material, and then heated at a high temperature to dehydrate and close the ring (imidization) to obtain polyimide. [0003] However, polyimide generally tends to be colored yellowish-brown essentially ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10C08K3/36
CPCC08G73/1067C08J5/18C08J2379/08C08K3/36C08K2201/005C08L2201/08C08L2201/10C08L2203/16C08L2203/20C08L2203/204C08L79/08C08G73/1039C09D179/08C07C7/10C08G73/10C08J5/00
Inventor 中山知则中山刚成加峯哲治北山直树
Owner UBE IND LTD
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