Control method of outer layer deviation of circuit board

Abstract

The invention discloses a control method of outer layer deviation of circuit boards. The control method comprises the steps of determining 1, 2, ..., N deviation influence factors on alignment between a through hole or a blind hole and an outer-layer bonding pad; determining alignment capacity models T according to the deviation influence factors, wherein the influence numerical values corresponding to the 1, 2, ..., N deviation influence factors are A, B, ..., X respectively; judging whether the deviation capacity of the through hole or the blind hole and the bonding pad meets requirements according to the values of the alignment capacity models T; if the alignment capacity models T can not meet the alignment requirements, adjusting the numerical values of one or more of the 1, 2, ..., N deviation influence factors and correcting the corresponding alignment capacity models T till the alignment capacity models T meet the corresponding alignment requirements. By means of the control method, the alignment capacity of different devices in different location modes can be worked out according to the alignment capacity models T, the optimal alignment manufacturing process can be determined by comparison, and therefore production and manufacturing of the circuit boards can be effectively directed.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for controlling the deviation of the outer layer of a circuit board. Background technique [0002] With the development trend of miniaturization, high performance, multi-function and high frequency and high speed of semiconductor products and packaging technology (IC Package), the corresponding packaging substrate must meet the requirements of "miniaturization, ultra-thin, high density", At present, it has excellent and extensive application prospects at home and abroad. Due to the increasingly smaller pitch design of substrate blind holes, this brings great challenges to the alignment control of circuit board manufacturers. Especially the outer layer alignment technology of the substrate (including "blind hole and pad, through hole and pad" offset control), the offset of these outer layers can be directly observed on the appearance of the product, and ...

AI Technical Summary

Problems solved by technology

[0004] For the first positioning method, since the positioning hole needs to be positioned with a pin, the positioning hole will be damaged and deformed after drilling the through hole and lowering the board. "Damage and deformation" will be more serious, resulting in poor positioning of subsequent blind holes and outer circuit production, resulting in deviation and scrapping

For the second positioning method, since the inner / outer pad of the blind hole is much smaller than the inner / outer pad of the through hole, affected by the greater hole position accuracy of the CNC drilling equipment, the "positioning hole" drilled by the CNC can guarantee blind positioning. The alignment between the hole and the outer layer pad is good, but it is easy to cause the blind hole to be misaligned with the inner layer pad, and the inner short is scrapped

For the third positioning method, there are two sets of positioning holes for x-ray punching, there will be no damage and deformation defects of the positioning holes, and there will be no blind holes and inner and outer pads that are displaced and scrapped. The comprehensive alignment effect is the best. The disadvantage is that the offset between the through hole and the pad is slightly larger

Due to the different manufacturing processes, equipment, process capabilities, and misalignment influencing factors of each manufacturer, it is difficult for the above-mentioned manufacturers to quickly and accurately obtain the alignment capability of the outer layer, let alone establish a misalignment model to analyze and optimize the alignment ability

In short, it is difficult to determine the alignment ability of the outer layer of the substrate, and the phenomenon of scrapping due to super-capacity production often occurs

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