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Laser processing system

A laser processing and processing technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as collision, laser device processing workpiece damage, and affecting laser processing efficiency, so as to avoid damage and improve efficiency.

Inactive Publication Date: 2014-12-24
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the adjustment process, if the operation is careless, the laser device is likely to collide with the surface of the workpiece, causing damage to the laser device and / or the processed workpiece, affecting the efficiency of laser processing

Method used

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Embodiment Construction

[0013] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0014] Please refer to figure 1 A laser processing system 100 according to an embodiment of the present invention includes a stage 10 , a laser device 20 for performing laser processing on a workpiece 200 to be processed, a height detection device 30 , and a driving mechanism 40 .

[0015] The stage 10 includes a working surface 11 , and the workpiece 200 to be processed is arranged at a predetermined processing position on the working surface 11 . Different workpieces 200 to be processed have different heights relative to the working surface 11 .

[0016] The laser device 20 is fixed on the drive mechanism 40, and the drive mechanism 40 is used to drive the laser device 20 to move. According to different requirements, the drive mechanism 40 can drive the laser device 20 in a plane parallel to the working surface 11. And move in a direction perpendicular to the wor...

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Abstract

The invention relates to a laser processing system which comprises a laser device used for laser processing, a height detection device and a platform deck. The height detection device is used for detecting the height of a workpiece to be processed and comprises a first laser light source arranged in the horizontal direction, a second laser light source arranged in the vertical direction, a light splitting element and a camera analyzing device, wherein a light beam emitted by the first laser light source is reflected by the light splitting element to reach the platform deck, and a light beam emitted by the second laser light source can penetrate through the light splitting element and directly reach the platform deck. The camera analyzing device comprise a camera module and a data processing module, wherein the camera module is used for shooting images of the first laser beam and the second laser beam on the platform deck and the surface of the workpiece to be processed, and the data analyzing module is used for analyzing the images to obtain the height of the workpiece.

Description

technical field [0001] The invention relates to a processing system, in particular to a laser processing system. Background technique [0002] In the field of laser processing, such as laser cutting, laser microstructure engraving and mold core processing, etc., it is necessary to focus the laser beam emitted by the laser device on the surface of the processed workpiece. Since different processed workpieces have different thicknesses, the laser The device needs to adjust its height according to the different thickness of the workpiece being processed. However, during the adjustment process, if the operation is careless, the laser device may easily collide with the surface of the workpiece, resulting in damage to the laser device and / or the processed workpiece, affecting the efficiency of laser processing. Contents of the invention [0003] In view of this, it is necessary to provide a laser processing system capable of preventing processing misoperation. [0004] A laser...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/064B23K26/03B23K26/38B23K26/362B23K26/70
CPCB23K26/032B23K26/36
Inventor 林辰翰
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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