Manufacturing method for discrete thermo-electricity separated ALPCB (Aluminum Printed Circuit Board)

Abstract

The invention discloses a manufacturing method for an ALPCB (Aluminum Printed Circuit Board) with an ultra-high heat conduction coefficient. The manufacturing method comprises the following steps: 1, the manufacture of an optical drawing template; 2, the manufacture of a copper-aluminium composite base plate; 3, the process for performing rough shape cutting on the copper-aluminium composite base plate, PP pieces and copper foils and drilling peripheral holes; 4, the manufacture of a heat conduction bonding pad, and the processing for forming a groove in a resin coated copper foil; 5, the process for press-fitting; 6, the manufacture of circuits and CCD target-shooting holes; 7, the process for resistance welding, and letter and surface processing; 8, the process for drilling a product functional hole; 9, the process for formation to obtain the finished product, namely the ALPCB with the ultra-high heat conduction coefficient. According to the invention, the manufacturing precision is high, the product practicability and durability are effectively improved, the property of the manufactured ALPCB is stable, and the quick and ultra-high heat conduction effect is achieved.

Description

technical field [0001] The invention relates to a manufacturing method of a discrete thermoelectric separation aluminum base circuit board. Background technique [0002] With the development of electronic products in the direction of miniaturization, practicality, environmental protection and energy saving, the traditional aluminum-based circuit board (hereinafter referred to as ALPCB) has become increasingly unable to meet the needs of electronic devices for heat conduction and heat dissipation. The traditional ALPCB process constitutes a layer of dielectric layer between the metal heat sink substrate and the conductor, which belongs to the upper and lower structure and is not on the same plane. The heat generated during use cannot be conducted quickly, which may easily cause aging or burnout. At present, the thermal conductivity of traditional ALPCB is only within 3.0W / M.K, which is far from the demand for rapid heat dissipation of electronic devices themselves. Discrete ...

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Problems solved by technology

[0002] With the development of electronic products in the direction of miniaturization, practicality, environmental protection and energy saving, the traditional aluminum-based circuit board (hereinafter referred to as ALPCB) has become increasingly unable to meet the needs of electronic devices for heat conduction and heat dissipation.

The traditional ALPCB process constitutes a layer of dielectric layer between the metal heat sink substrate and the conductor, which belongs to the upper and lower structure and is not on the same plane. The heat generated during use cannot be conducted quickly, which is likely to cause aging or burnout. At present, the thermal conductivity of traditional ALPCB is only within 3.0W / M.K, which is far from the demand for rapid heat dissipation of electronic devices.

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