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Putty-like heat transfer material and method for producing same

A manufacturing method and technology of putty, which are applied in the directions of heat exchange materials, chemical instruments and methods, electrical components, etc., can solve the problems of reduced fluidity, the addition amount of inorganic particle filling materials is set to a large amount, and its own shape retention is low. , to achieve the effect of good liquidity

Inactive Publication Date: 2014-11-05
FUJI POLYMER INDUSTRIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since patent documents 1 and 2 use gel, there is a problem that the composition is hard and difficult to extrude from a tube or syringe, and there is a problem that it is difficult to set the amount of the inorganic particle filler to be added in a large amount. the problem of reduced liquidity
Patent Document 3 has a problem of low self-shape retention in a static state because liquid silicone is used

Method used

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  • Putty-like heat transfer material and method for producing same
  • Putty-like heat transfer material and method for producing same
  • Putty-like heat transfer material and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090]

[0091] Two-component room temperature curing silicone rubber (two-component RTV) as a silicone component is weighed so that the mass ratio of liquid A: liquid B reaches a ratio of 7:3 in CF5036 (manufactured by Dow Corning Toray Silicone Co., Ltd.). "A solution (contains a polysiloxane base polymer component containing vinyl groups at both ends (called Vi-based component) and a Pt catalyst component, and the Vi-based component is contained in the same amount as the Vi-based component of B liquid) and B liquid (Si-H group: Vi group is 1:1 in terms of molar ratio, including an organopolysiloxane containing an average of 2 or more hydrogen atoms bonded to silicon atoms in 1 molecule as a crosslinking component (referred to as Si-H-based components), and Vi-based components). As for all the liquids A and B, the Si—H group was 0.3 mol with respect to 1 mol of the Vi group. Moreover, (a)-(c) component of this invention was previously added to "CF5036".

[0092]

[009...

Embodiment 2

[0112] In Example 1, it experimented similarly to Example 1 except having set A liquid:B liquid=8:2. The amount of organopolysiloxane containing an average of 2 or more hydrogen atoms bonded to silicon atoms in one molecule of the crosslinking component of liquid B was 0.2 mol per 1 mol of silicon atom-bonded alkenyl groups in liquid A.

[0113] The resulting putty-like heat transfer material is easily extruded from a tube or syringe and has self-shape retention in a standing state. In addition, dissolution also occurred in the dissolution test with the same solvent as in Example 1. Furthermore, the physical properties are as follows.

[0114] Viscosity: 1,500Pa·s (precision rotational viscometer RotoVisco (RV1), 25°C, shear rate 1 / s)

[0115] Thermal conductivity: 3.2W / m K (ASTM D2326, hot plate method (TPA-501))

Embodiment 3

[0117] In Example 1, it experimented similarly to Example 1 except having set A liquid:B liquid=6:4. The amount of organopolysiloxane containing an average of 2 or more hydrogen atoms bonded to silicon atoms in one molecule of the crosslinking component of Liquid B was 0.4 mol per 1 mol of silicon atom-bonded alkenyl groups in Liquid A.

[0118] The resulting putty-like heat transfer material is easily extruded from a tube or syringe and has self-shape retention in a standing state. In addition, dissolution also occurred in the dissolution test with the same solvent as in Example 1. Furthermore, the physical properties are as follows.

[0119] Viscosity: 4,000Pa·s (precision rotational viscometer RotoVisco (RV1), 25°C, shear rate 1 / s)

[0120] Thermal conductivity: 3.2W / m K (ASTM D2326, hot plate method (TPA-501))

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Abstract

A putty-like heat transfer material according to the present invention comprises heat-conductive particles dispersed in an organopolysiloxane, wherein the organopolysiloxane is a silicone sol produced by partially crosslinking a base polymer (a) with a crosslinking component (b), wherein the base polymer (a) comprises an organopolysiloxane that contains at least two alkenyl groups each bound to a silicon atom located at the terminal of the molecular chain (also referred to as "silicon-atom-bound alkenyl groups") per molecule on average, the crosslinking component (b) comprises an organopolysiloxane that contains at least two hydrogen atoms each bound to a silicon atom per molecule on average, and the partial crosslinking is carried out at such a ratio that the amount of the crosslinking component (b) is less than 1 mole relative to 1 mole of the silicon-atom-bound alkenyl group contained in the component (a). Thus, provided are: a putty-like heat transfer material which can exhibit good fluidability even when an inorganic particulate filler is added in a larger amount, can be extruded through a tube or a syringe readily, and can have a self-shape-retaining property when being allowed to stand; and a method for producing the putty-like heat transfer material.

Description

technical field [0001] The present invention relates to a putty-like heat transfer material interposed between a heat-generating body such as a heat-generating electronic component and a heat radiation cooler such as a radiator, and a method for producing the same. Background technique [0002] In recent years, electronic devices such as flat-screen TVs, personal computers, digital cameras, and electroluminescence (LED) have achieved remarkable performance improvements, and many heat-generating electronic components have been inserted at high density in ever-smaller mounting areas. Along with this, high thermal conductivity is also required for heat transfer materials used to fill fine unevenness of heat-generating electronic components and to dissipate heat to heat sinks. [0003] Conventionally, a grease using a cross-linked silicone gel has been proposed as a heat transfer material interposed between a heat-generating electronic component mounted on a substrate and a radi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/08C08K7/16C08L83/05C08L83/07H01L23/373
CPCC08K7/16H01L23/3737C09K5/14H01L2924/0002C08G77/12C08G77/20C08L83/04C08K9/06C08L83/00C08K2003/2227C09K5/06H01L2924/00
Inventor 服部真和
Owner FUJI POLYMER INDUSTRIES CO LTD
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