Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Via hole design method for improving capacitor decoupling effect

A design method and capacitor technology, applied in the field of electronics, can solve the problems of affecting the performance of PCB power supply, discount of capacitor decoupling effect, large capacitor return path, etc., to achieve the effect of improving design quality, reducing design space and simple operation

Inactive Publication Date: 2014-11-05
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The most commonly used design method in the current stage of PCB design (common capacitor via wiring method) introduces leads of about 12mil, and the via holes are distributed on the left and right sides of the capacitor, which will lead to a large return path of the capacitor and a relatively large return path. A large parasitic inductance will result in a large parasitic inductance, which will greatly reduce the decoupling effect of the capacitor and affect the performance of the PCB power supply.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Via hole design method for improving capacitor decoupling effect
  • Via hole design method for improving capacitor decoupling effect
  • Via hole design method for improving capacitor decoupling effect

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0027] Example 1. The type of capacitor package is relatively large, and a via hole can be placed between the two capacitor pads;

example 2

[0028] Example 2: The package type of the capacitor is small, and a via cannot be placed between the two capacitor pads.

[0029] By analyzing the position of the capacitor via hole, find out the placement method that is most conducive to reducing the loop area, so as to optimize the decoupling effect.

[0030] Such as figure 2 As shown, by punching the via hole of the large package capacitor on the inside of the capacitor pad.

[0031] Such as image 3 As shown, the vias of the capacitors in the small package are punched on both sides of the capacitor pad.

[0032] In this way, the parasitic inductance of the leads and the plane (power supply and ground) is greatly reduced, and at the same time, the return path of the capacitor is greatly reduced, the decoupling effect of the capacitor is greatly enhanced, and the wiring space of the capacitor is reduced, saving PCB layout space. It reduces the risk of PCB board components not being placed properly.

[0033] The impact...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a via hole design method for improving the capacitor decoupling effect, and relates to the technical field of circuit board design. The method comprises the steps of determining the position of the power input end, the position of the load end and the transmission path of a power source; determining the pin of a load needing to be decoupled and finding out the suitable placement position of a capacitor according to the position of the pin and the wiring space, wherein it is guaranteed that the current-returning path of the capacitor and the pin in the process is the shortest; punching via holes of the capacitor in the middle or the two sides of the capacitor. Thus, the installation inductance parasitic effect of the capacitor is reduced, and the capacitor decoupling effect is greatly improved.

Description

technical field [0001] The invention relates to the field of electronics, in particular to a via hole design method for improving the decoupling effect of a capacitor, so as to reduce the parasitic effect of the installation inductance of the capacitor and enhance the decoupling effect of the capacitor. Background technique [0002] In the design process of the circuit board, the power supply is an indispensable part. The power supply is not an ideal power supply, and there will definitely be noise. The decoupling capacitor is an essential component to remove power supply noise, and occupies a large part of the circuit board, so the design of the decoupling capacitor has a great impact on the performance of the PCB board and its power supply. [0003] The decoupling capacitor does not completely represent the capacitive nature of the capacitor. In actual use, the capacitor can be simply equivalent to the equivalent mode of RLC, where the left side of the resonance point is c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 李德恒
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com