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Light-emitting diode display panel, manufacturing method thereof, and display device

A technology for light-emitting diodes and display panels, used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as scratches on the backplane of thin film transistors, static electricity, etc., to reduce IR voltage drop, reduce costs, and prevent scratches effect of injury

Active Publication Date: 2017-02-22
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a light-emitting diode display panel and its manufacturing method and display device, which solves the problem that the evaporation mask plate is easy to scratch the thin-film transistor backplane and cause static electricity when the light-emitting structure is produced in the existing light-emitting diode display panel. technical problem

Method used

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  • Light-emitting diode display panel, manufacturing method thereof, and display device
  • Light-emitting diode display panel, manufacturing method thereof, and display device
  • Light-emitting diode display panel, manufacturing method thereof, and display device

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Embodiment Construction

[0034] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0035] The present invention firstly provides a light emitting diode display panel, and the light emitting diode display panel may be an organic light emitting diode (OLED) display panel. The schematic cross-sectional view of the display panel is shown as figure 1 As shown, the plan view of the display panel is shown in figure 2 shown.

[0036] The light emitting diode display panel includes a thin film transistor backplane and a light emitting structure, and the light emitting diode display panel further includes a protective film 10, and the protective film 10 is located between the thin film transistor backplane and the light emitting structure. The prote...

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Abstract

The invention discloses a light-emitting diode display panel, a manufacturing method thereof, and a display device, and relates to the field of display technology. The light emitting diode display panel includes a thin film transistor backplane and a light emitting structure, and the light emitting diode display panel further includes a protective film, the protective film is located between the thin film transistor backplane and the light emitting structure, and the protective film covers The LED display panel displays gate lines and data lines in the display area. The protection film also covers the circuits around the display area of ​​the LED display panel. The present invention adds a protective film process to the manufacturing process of the existing light-emitting diode display panel, which can effectively prevent the scratching of the thin-film transistor backplane by the evaporation mask and the static electricity problem caused by the evaporation mask when making the light-emitting structure.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a light-emitting diode display panel, a manufacturing method thereof, and a display device including the light-emitting diode display panel. Background technique [0002] Compared with the liquid crystal display that currently dominates the market, the light-emitting diode display has the advantages of simple process, wide viewing angle, fast response speed, high brightness, high contrast, bright color, wide working range, light weight, thin thickness, and low power consumption. Series advantages. [0003] In the production process of the light-emitting diode display panel, when the light-emitting layer is evaporated by mask evaporation method, the mask plate and the thin film transistor backplane need to be closely attached. If the edge of the mask plate is defective, it will When it is in place, it will scratch the backplane of the thin film transistor, resulting in s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/15H01L21/77
CPCH10K59/122H10K59/124H10K59/126H10K50/824H01L21/77H01L27/15H01L27/124H01L27/1262H01L33/42H01L33/44
Inventor 李永谦
Owner BOE TECH GRP CO LTD
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