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A kind of conductive polymer microcapsule of reactive liquid core material and preparation method thereof

A conductive polymer and microcapsule technology, which is applied in the direction of microcapsule preparation, microsphere preparation, coating, etc., to achieve the effect of simple preparation method, cheap raw materials, and favorable industrial production

Inactive Publication Date: 2016-02-03
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In fact, the research on encapsulating reactive liquid core materials with conductive polymer microcapsules has not been reported yet.

Method used

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  • A kind of conductive polymer microcapsule of reactive liquid core material and preparation method thereof
  • A kind of conductive polymer microcapsule of reactive liquid core material and preparation method thereof
  • A kind of conductive polymer microcapsule of reactive liquid core material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027]50 ml of an aqueous solution containing 3 wt % gum arabic was prepared at room temperature and heated to 40°C. 10 g of isocyanate (containing 8.5 g of HDI and 1.5 g of MDI prepolymer) was added to the above aqueous solution of gum arabic, and stirred at a speed of 600 rpm for 15 min. Then react at a stirring speed of 150 rpm for 90 min. After natural cooling, the product was washed 6 times with deionized water to obtain a suspension. At room temperature, add 35.56g of 15.64wt% ferric chloride (III) hydrochloric acid aqueous solution (that is, contain 5.56g of anhydrous ferric chloride and 30g0.1mol / l hydrochloric acid aqueous solution) in the above-mentioned suspension, and at a rotating speed of 200rpm Under mechanical stirring. After 10 minutes, a total of 31 g of 3.23 wt % pyrrole aqueous solution (ie containing 1 g of pyrrole and 30 g of water) was added to the system in 8 times at intervals of 10 minutes each time. After continuing to stir at room temperature for...

Embodiment 2

[0031] 50 ml of an aqueous solution containing 3 wt % gum arabic was prepared at room temperature and heated to 40°C. 10 g of isocyanate (containing 8.5 g of HDI and 1.5 g of MDI prepolymer) was added to the above aqueous solution of gum arabic, and stirred at a speed of 1200 rpm for 15 min. Then react at a stirring speed of 150 rpm for 90 min. After natural cooling, the product was washed 6 times with deionized water to obtain a suspension. At room temperature, add 35.56g of 15.64wt% ferric chloride (III) hydrochloric acid aqueous solution (that is, contain 5.56g of anhydrous ferric chloride and 30g0.1mol / l hydrochloric acid aqueous solution) in the above-mentioned suspension, and at a rotating speed of 200rpm Under mechanical stirring. After 10 minutes, a total of 31 g of 3.23 wt % pyrrole aqueous solution (ie containing 1 g of pyrrole and 30 g of water) was added to the system in 8 times at intervals of 10 minutes each time. After continuing to stir at room temperature f...

Embodiment 3

[0035] 50 ml of an aqueous solution containing 3 wt % gum arabic was prepared at room temperature and heated to 40°C. Add 10 g of isocyanate (containing 8.5 g of HDI dimer and 1.5 g of MDI prepolymer) to the above aqueous solution of gum arabic, and stir at 800 rpm for 10 min. Then react at a stirring speed of 150 rpm for 30 min. After natural cooling, the product was washed 6 times with deionized water to obtain a suspension. At room temperature, add 35.56g of 15.64wt% ferric chloride (III) hydrochloric acid aqueous solution (that is, contain 5.56g of anhydrous ferric chloride and 30g0.1mol / l hydrochloric acid aqueous solution) in the above-mentioned suspension, and at a rotating speed of 200rpm Under mechanical stirring. After 10 minutes, a total of 31 g of 3.23 wt % pyrrole aqueous solution (ie containing 1 g of pyrrole and 30 g of water) was added to the system in 8 times at intervals of 10 minutes each time. After continuing to stir at room temperature for 4.5 h, the o...

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Abstract

The invention relates to a conductive polymer microcapsule of a reactive liquid core material and a preparation method thereof, belonging to the technical field of preparation of functional materials. The preparation method is as follows: configure an aqueous solution containing surfactant at room temperature, heat it to 30-60°C, add a reactive liquid core material 0.05-0.25 times its mass, and stir at a speed of 200-2000rpm for 10-30min, then Reduce the stirring speed to 50-200rpm and continue for 30-120min. After natural cooling, the product is washed with deionized water to obtain a suspension; add an aqueous solution of an acidic oxidant or an aqueous solution of a heteroaromatic ring monomer that is 1 to 5 times the mass of the core material to the suspension , after reacting for 5 to 20 minutes at room temperature and under mechanical stirring at 100 to 300 rpm, add 5 to 20 times at intervals of 2 to 20 minutes and add heteroaromatic ring monomers whose total amount is equivalent to 1 to 5 times the mass of the core material The aqueous solution or the acidic oxidant aqueous solution is polymerized for 1-12 hours, and finally washed with deionized water and dried, and the aqueous solution added for the first time in this step is not the same substance as the aqueous solution added later. The method of the invention is simple, the raw material is cheap, and the product is easy to collect.

Description

Technical field: [0001] The invention relates to a conductive polymer microcapsule of a reactive liquid core material and a preparation method thereof, belonging to the technical field of preparation of functional materials. technical background: [0002] With the advent of polyacetylene in the 1970s, conducting polymers have attracted considerable attention in related fields of science and technology because of their superior electrical conductivity and electroactivity. Conductive polymers doped with various elements or groups can maintain a certain degree of mechanical flexibility and high thermal stability while having excellent electrical conductivity and electrical activity, so that they can be used in heat dissipation, antistatic, Electromagnetic shielding, anti-corrosion, light-emitting devices, electrical displays, biosensors and actuators have extremely broad application prospects. [0003] It is of great significance to microencapsulate materials and wrap various ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01J13/14C08G73/06C08G73/02C09D7/12
Inventor 吴刚向勇胡琮瑾叶涛
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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