Conductive polymer microcapsule of reactive liquid core material and preparation method thereof

A conductive polymer and microcapsule technology, which is applied in the direction of microcapsule preparation, microsphere preparation, coating, etc., to achieve the effect of cheap raw materials, beneficial to industrial production, and easy to dry and collect

Inactive Publication Date: 2014-09-10
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In fact, the research on encapsulating reactive liquid core materials with conductive polymer microcapsules has not been reported yet.

Method used

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  • Conductive polymer microcapsule of reactive liquid core material and preparation method thereof
  • Conductive polymer microcapsule of reactive liquid core material and preparation method thereof
  • Conductive polymer microcapsule of reactive liquid core material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027]50 ml of an aqueous solution containing 3 wt % gum arabic was prepared at room temperature and heated to 40°C. 10 g of isocyanate (containing 8.5 g of HDI and 1.5 g of MDI prepolymer) was added to the above aqueous solution of gum arabic, and stirred at a speed of 600 rpm for 15 min. Then react at a stirring speed of 150 rpm for 90 min. After natural cooling, the product was washed 6 times with deionized water to obtain a suspension. At room temperature, add 35.56g of 15.64wt% ferric chloride (III) hydrochloric acid aqueous solution (that is, contain 5.56g of anhydrous ferric chloride and 30g0.1mol / l hydrochloric acid aqueous solution) in the above-mentioned suspension, and at a rotating speed of 200rpm Under mechanical stirring. After 10 minutes, a total of 31 g of 3.23 wt % pyrrole aqueous solution (ie containing 1 g of pyrrole and 30 g of water) was added to the system in 8 times at intervals of 10 minutes each time. After continuing to stir at room temperature for...

Embodiment 2

[0031] 50 ml of an aqueous solution containing 3 wt % gum arabic was prepared at room temperature and heated to 40°C. 10 g of isocyanate (containing 8.5 g of HDI and 1.5 g of MDI prepolymer) was added to the above aqueous solution of gum arabic, and stirred at a speed of 1200 rpm for 15 min. Then react at a stirring speed of 150 rpm for 90 min. After natural cooling, the product was washed 6 times with deionized water to obtain a suspension. At room temperature, add 35.56g of 15.64wt% ferric chloride (III) hydrochloric acid aqueous solution (that is, contain 5.56g of anhydrous ferric chloride and 30g0.1mol / l hydrochloric acid aqueous solution) in the above-mentioned suspension, and at a rotating speed of 200rpm Under mechanical stirring. After 10 minutes, a total of 31 g of 3.23 wt % pyrrole aqueous solution (ie containing 1 g of pyrrole and 30 g of water) was added to the system in 8 times at intervals of 10 minutes each time. After continuing to stir at room temperature f...

Embodiment 3

[0035] 50 ml of an aqueous solution containing 3 wt % gum arabic was prepared at room temperature and heated to 40°C. Add 10 g of isocyanate (containing 8.5 g of HDI dimer and 1.5 g of MDI prepolymer) to the above aqueous solution of gum arabic, and stir at 800 rpm for 10 min. Then react at a stirring speed of 150 rpm for 30 min. After natural cooling, the product was washed 6 times with deionized water to obtain a suspension. At room temperature, add 35.56g of 15.64wt% ferric chloride (III) hydrochloric acid aqueous solution (that is, contain 5.56g of anhydrous ferric chloride and 30g0.1mol / l hydrochloric acid aqueous solution) in the above-mentioned suspension, and at a rotating speed of 200rpm Under mechanical stirring. After 10 minutes, a total of 31 g of 3.23 wt % pyrrole aqueous solution (ie containing 1 g of pyrrole and 30 g of water) was added to the system in 8 times at intervals of 10 minutes each time. After continuing to stir at room temperature for 4.5 h, the o...

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Abstract

The invention relates to a conductive polymer microcapsule of a reactive liquid core material and a preparation method thereof, which belong to the technical field of functional material preparation. The preparation method comprises the following steps: preparing a surfactant-containing aqueous solution at room temperature; heating the aqueous solution to 30-60 DEG C; adding the reactive liquid core material the mass of which is 0.05-0.25 times that of the aqueous solution; stirring at the speed of 200-2000 rpm for 10-30 minutes; stirring at the lowered speed of 50-200 rpm for 30-120 minutes; after natural cooling, washing a product by deionized water to obtain a suspension; adding an acidic oxidant aqueous solution or an aromatic heterocyclic monomer aqueous solution, the mass of which is 1-5 times that of the core material, into the suspension; reacting at room temperature for 5-20 minutes under the condition of mechanical stirring at the speed of 100-300 rpm; adding an aromatic heterocyclic monomer aqueous solution or an acidic oxidant aqueous solution for 5-20 times at interval of 2-20 minutes, wherein the total mass of the added solution is equivalent to 1-5 times the mass of the core material; polymerizing for 1-12 hours; and finally, washing by deionized water and drying, wherein the firstly added aqueous solution and the later added aqueous solution are not the same substance. The preparation method is simple, the raw materials are cheap and the products are easy to collect.

Description

Technical field: [0001] The invention relates to a conductive polymer microcapsule of a reactive liquid core material and a preparation method thereof, belonging to the technical field of preparation of functional materials. technical background: [0002] With the advent of polyacetylene in the 1970s, conducting polymers have attracted considerable attention in related fields of science and technology because of their superior electrical conductivity and electroactivity. Conductive polymers doped with various elements or groups can maintain a certain degree of mechanical flexibility and high thermal stability while having excellent electrical conductivity and electrical activity, so that they can be used in heat dissipation, antistatic, Electromagnetic shielding, anti-corrosion, light-emitting devices, electrical displays, biosensors and actuators have extremely broad application prospects. [0003] It is of great significance to microencapsulate materials and wrap various ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J13/14C08G73/06C08G73/02C09D7/12
Inventor 吴刚向勇胡琮瑾叶涛
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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