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Hot-melt adhesive for pipe adhesion of plate-type evaporator

A technology of plate evaporator and hot melt adhesive, which is applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of unstable adhesive force of hot melt adhesives and inability to guarantee adhesive fastness, etc. Achieve the effects of stable cohesion, non-combustibility and easy transportation

Inactive Publication Date: 2014-09-03
HEFEI GREAT WALL REFRIGERATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing pasting method, hot melt adhesive is used for pasting. For such hot melt adhesive, there are high requirements for thermal conductivity and sticking firmness. Influenced by temperature and humidity changes in the morning and evening in the environment, this cannot guarantee the bonding fastness

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A hot-melt adhesive for sticking tubes of plate evaporators. The raw materials and parts by weight of the hot-melt adhesive are: 90 parts of ethylene vinyl acetate copolymer; 5 parts of paraffin wax; 4 parts of hydrogenated rosin glycerin; 0.3 parts of organic silicon ; Nitrate 0.4 parts. The basic resin is ethylene-vinyl acetate copolymer; in the ethylene-vinyl acetate copolymer, vinyl acetate accounts for 19%-40% of the weight of the ethylene-vinyl acetate copolymer.

Embodiment 2

[0015] A hot-melt adhesive for sticking tubes of plate evaporators. The raw materials and parts by weight of the hot-melt adhesive are as follows: the raw materials and weight ratio of the hot-melt adhesive are: 94 parts of polyamide resin; 4 parts of paraffin; hydrogenated 6 parts of rosin glycerin; 0.4 parts of organic silicon; 0.3 parts of nitrate. The basic resin is ethylene-vinyl acetate copolymer;

[0016] In the ethylene-vinyl acetate copolymer, vinyl acetate accounts for 19%-40% by weight of the ethylene-vinyl acetate copolymer.

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PUM

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Abstract

The invention discloses a hot-melt adhesive for the pipe adhesion of a plate-type evaporator. The hot-melt adhesive comprises the following components in parts by weight: 60-100 parts of basic resin, 4-6 parts of paraffins, 4-6 parts of hydrogenated rosin glycerin ester, less than 0.5 part of organic silicon and less than 0.5 part of nitrate The hot-melt adhesive disclosed by the invention overcomes the defects of the prior art and has the advantages of reasonable formula design, high solidifying speed and stable adhesive force.

Description

technical field [0001] The invention relates to the technical field of refrigeration, in particular to a hot-melt adhesive used for sticking tubes of plate evaporators. Background technique [0002] The plate evaporator is the main heat exchange device in the refrigeration system. Its function is to quickly evaporate (boil) the low-temperature and low-pressure liquid refrigerant into steam, absorb the heat of the cooled substance, and make the temperature of the refrigerated (frozen) substance Decrease to achieve the purpose of cooling. The evaporator is mainly made of a metal tube and a metal plate, and the aluminum tube and the aluminum plate are directly bonded. In the existing pasting method, hot melt adhesive is used for pasting. For such hot melt adhesive, there are high requirements for thermal conductivity and sticking firmness. The impact of temperature and humidity changes in the morning and evening in the environment, which cannot guarantee the bonding fastness....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J177/00C09J11/04C09J11/06C09J11/08
Inventor 马功权田四光李多春
Owner HEFEI GREAT WALL REFRIGERATION TECH
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