Packaging substrate, semiconductor package and fabrication methods thereof

Abstract

A packaging substrate is disclosed, which includes: an encapsulant having opposite first and second surfaces; a plurality of conductive elements embedded in the encapsulant, wherein each of the conductive elements has a first conductive pad exposed from the first surface of the encapsulant and a second conductive pad exposed from the second surface of the encapsulant; and a protection layer formed on the second surface of the encapsulant and the second conductive pads so as to protect the second surface of the encapsulant from being scratched.

Description

technical field [0001] The invention relates to a semiconductor package, in particular to a semiconductor package with improved yield rate and a manufacturing method thereof. Background technique [0002] With the evolution of semiconductor packaging technology, different packaging types have been developed for semiconductor packages. In the prior art, the semiconductor package mainly forms a multi-layer circuit structure on a core layer to make a packaging substrate, and then installs The chip is placed on the packaging substrate, and the chip is electrically connected to the multi-layer circuit structure, and finally packaged with packaging glue. However, since the core layer of the package substrate formed in this way occupies a certain thickness, it is limited to reduce the thickness of the package. Therefore, the industry has developed a package substrate without a core layer, which omits the use of the core layer to reduce the height of the package, and this package c...

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Problems solved by technology

[0013] However, in the existing semiconductor package 1, before the semiconductor component 15 is installed, the second surface 11b of the first encapsulant 11 is exposed, so the first encapsulant 11 is easily damaged by handling or external impact. The second surface 11b is scratched, or the first encapsulant 11 is cracked, causing the product to be scrapped

[0014] In addition, the second electrical connection pad 122 is exposed before the packaging process, so it needs to be protected by Organic Solderability Preservative (OSP) to prevent the second electrical connection pad 122 from being oxidized. cost of production

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