Method for coupling and aligning optical fiber and integrated chip and coupling and aligning module thereof

Abstract

The invention relates to a method for coupling and aligning an optical fiber and an integrated chip and a coupling and aligning module thereof. The coupling and aligning module comprises an optical fiber fixing block and the integrated chip, the optical fiber fixing block and the integrated chip are provided with V-shaped grooves for containing the optical fiber, and the distance and the size of the V-shaped groove in the optical fiber fixing block are identical with those of the V-shaped groove in the integrated chip. The V-shaped groove in the optical fiber fixing block and the V-shaped groove in the integrated chip are staggered by a certain distance in the height direction, and / or are staggered by a certain distance in the longitudinal direction of containing the optical fiber and form a certain included angle, so that the optical fiber extending out of the V-shaped groove of the optical fiber fixing block lands into the V-shaped groove of the integrated chip in a slight curving state, and the optical fiber is completely fixed through matching glue with certain bonding strength. According to the method for coupling and aligning the optical fiber and the integrated chip and the coupling and aligning module thereof, the curving stress of the optical fiber is used for solving the problem that in the waveguide coupling process of the optical fiber and the integrated chip, coupling insertion losses are large due to the fact that the optical fiber floats above the V-shaped grooves.

Description

technical field [0001] The invention relates to a coupling and alignment method for realizing an optical fiber and an integrated chip and a coupling alignment module thereof, and the invention belongs to the communication field. Background technique [0002] In the optical communication system, the mutual conversion of electrical signals and optical signals is indispensable, which requires high-speed electro-optical modulators and photodetectors and other key components. Due to its low comprehensive cost, small size, and easy large-scale The advantages of high production and high working speed have become the fundamental way to realize high-speed optical communication. Among them, silicon is the most widely used material, and various silicon-based photonic devices such as high-speed electro-optic modulators, photodetectors, lasers, and integrated chips have emerged and gradually matured. [0003] As we all know, optical fibers need to be used to transmit optical signals in ...

AI Technical Summary

Problems solved by technology

The biggest problem with this method is that the chip needs to have a large enough area and height for placing flat glass, which is contradictory to the current increasingly miniaturized chip design.

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