Method for manufacturing integrated photolithography plate and method for sorting LED chip grains

A production method and technology for photolithography, which are applied in the photomechanical process of photomechanical processing of originals, optics, and pattern surfaces, etc., can solve the problems that various specifications of grains cannot be sorted quickly, efficiently and easily.

Active Publication Date: 2017-08-25
XIANGNENG HUALEI OPTOELECTRONICS
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Problems solved by technology

[0005] The purpose of the present invention is to provide an integrated photolithographic plate manufacturing method and a sorting method for LED chip grains, so as to solve the technical problem in the prior art that various patterns and grains of various specifications on a wafer cannot be sorted quickly, efficiently and easily.

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  • Method for manufacturing integrated photolithography plate and method for sorting LED chip grains
  • Method for manufacturing integrated photolithography plate and method for sorting LED chip grains
  • Method for manufacturing integrated photolithography plate and method for sorting LED chip grains

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Embodiment Construction

[0021] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.

[0022] The invention provides a manufacturing method of an integrated photolithography board and a sorting method of LED chips. The method designs the distribution positions of crystal grain templates with different patterns and specifications on the integrated photolithography board on corresponding coordinate points of the template. After using the integrated photolithography board to make crystal grains, the positions of different graphics and different specifications of grains are fixed, and by modifying the Bin value of the grains at the corresponding positions, the sorting of LED chips can be completed through the sorting machine, while No need to rely on CCD cameras, which improves the efficiency and accuracy of sorting.

[0023] The inventio...

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Abstract

The invention provides an integrated photolithography plate manufacturing method and a sorting method for producing LED chips. Wherein the method for making the integrated photoresist comprises the following steps: 1) two dividing lines arranged perpendicular to each other on the integrated photoresist divide the photoresist into four quadrants, and use the two dividing lines as abscissa lines and The ordinate forms a coordinate system; 2) in any quadrant, taking the zero point of the coordinate system as a reference, extending to the abscissa line and the ordinate direction to form a square standard cell area containing at least one grain template; 3) in four quadrants , consecutively set a plurality of comparison unit areas with the same graphics and specifications as the grain templates in the standard unit area, and the arrangement position of each grain template in each comparison unit area is the same as that of each grain template in the standard cell area , so as to obtain an integrated photolithography plate. This method quickly separates the crystal grains of the LED chip by designing the pattern and specification of the crystal grains on the integrated photolithography board.

Description

technical field [0001] The invention relates to the field of LED (Light Emitting Diode) chip preparation, in particular to a method for manufacturing an integrated photolithography plate and a method for sorting LED chip grains. Background technique [0002] The photoelectric characteristics of LED chips are determined by their specifications and graphics. During the LED chip preparation process, the surface pattern of the chip is determined by the photolithography plate (photolithography mask plate). In the experimental process of manufacturing LED chips with different specifications and different graphics, in the prior art, photolithographic plates consistent with the specifications and graphics of the required LED chips are often used for manufacturing. It is impossible to obtain LED chips of various specifications and graphics on one photolithography board at the same time. The photolithography plate is expensive, and this preparation method will increase the productio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F1/38H01L33/00
Inventor 陈小雪王红锋彭超
Owner XIANGNENG HUALEI OPTOELECTRONICS
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