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Cleaning technology of polished wafer containing box

A technology for a slide box and a polishing sheet, which is applied to the cleaning process field of the polishing sheet slide box, can solve the problems of increasing surface particle size, reducing the cost of auxiliary materials, disadvantages, etc. Effect

Active Publication Date: 2014-07-23
无锡长三角光电新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the industry mainly uses outsourced no-clean slide boxes (mainly PVC, PP, PE, PS, etc.) After a period of time, the particle size of the surface increases, and it is not conducive to reducing the cost of auxiliary materials if the slide box with high cleanliness is used

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A cleaning process for a polishing film carrier box includes the following steps:

[0018] a. Put pure water at 30℃ into the cleaning tank and add hydrophilic organic solvent, stir the pure water and hydrophilic organic solvent evenly to obtain a cleaning solution, the volume ratio of pure water to hydrophilic organic solvent is 20 :1. The hydrophilic organic solvent is composed of ethanol and acetone with a volume ratio of 1:1. The slide box is immersed in the cleaning solution in the cleaning tank for 18 minutes and then taken out;

[0019] b. Rinse the removed slide box with pure water until there is no obvious detergent foam on the surface of the slide box;

[0020] c. Put the rinsed slide box into the cleaning rack, and make the bottom surface of the slide box and the bottom of the cleaning rack vertical, and then put the cleaning rack with the slide box into the cleaning tank of the ultrasonic cleaning machine for ultrasonic For cleaning, the ultrasonic frequency is 40K...

Embodiment 2

[0028] A cleaning process for a polishing film carrier box includes the following steps:

[0029] a. Put pure water at 25°C into the cleaning tank and add ethanol, stir the pure water and ethanol evenly to obtain a cleaning solution, the volume ratio of pure water to ethanol is 15:1, and immerse the slide box in the cleaning tank Soak in the cleaning solution for 15 minutes and take it out;

[0030] b. Rinse the removed slide box with pure water until there is no obvious detergent foam on the surface of the slide box;

[0031] c. Put the rinsed slide box into the cleaning rack, and make the bottom surface of the slide box and the bottom of the cleaning rack vertical, and then put the cleaning rack with the slide box into the cleaning tank of the ultrasonic cleaning machine for ultrasonic For cleaning, the ultrasonic frequency is 30KHZ, the ultrasonic power is 60W, the ultrasonic cleaning temperature is controlled at 30℃, the ultrasonic cleaning time is controlled at 10min, and the s...

Embodiment 3

[0039] A cleaning process for a polishing film carrier box includes the following steps:

[0040] a. Put the pure water at 35℃ in the cleaning tank and add the hydrophilic organic solvent. Stir the pure water and the hydrophilic organic solvent evenly to obtain the cleaning solution. The volume ratio of pure water to hydrophilic organic solvent is 25 :1. The hydrophilic organic solvent is composed of ether and acetone with a volume ratio of 1:1. The slide box is immersed in the cleaning solution in the cleaning tank for 20 minutes and then taken out;

[0041] b. Rinse the removed slide box with pure water until there is no obvious detergent foam on the surface of the slide box;

[0042] c. Put the rinsed slide box into the cleaning rack, and make the bottom surface of the slide box and the bottom of the cleaning rack vertical, and then put the cleaning rack with the slide box into the cleaning tank of the ultrasonic cleaning machine for ultrasonic For cleaning, the ultrasonic freque...

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Abstract

The invention relates to a cleaning technology of a polished wafer containing box. The cleaning technology comprises the following steps that pure water is put in a cleaning tank, hydrophilic organic solvent is added, a cleaning solution is obtained, and the wafer containing box is immersed into the cleaning solution in the cleaning tank and then is taken out; the pure water is used for flushing the taken wafer containing box until the surface of the wafer containing box is free of obvious cleaning agent foam; the flushed wafer containing box is put in a cleaning rack, then the cleaning rack which is provided with the wafer containing box is placed in a cleaning tank of an ultrasonic cleaner for conducting ultrasonic cleaning, and after ultrasonic cleaning is completed, the wafer containing box is taken out; a piece of non-dust cloth is used for being dipped with ethyl alcohol to wipe the surface of the wafer containing box; the gas sprayed by a gas gun is used for drying the wafer containing box in blowing and spraying modes; at last, the dried wafer containing box is conveyed to a clean chamber or a clean workbench for standby application. The wafer containing box cleaned through the cleaning technology can be used for replacing a high-cleanliness wafer containing box, the cost of high-cleanliness auxiliary materials is omitted, and the control over surface particles of the polished wafer surface is enhanced.

Description

Technical field [0001] The present invention relates to the technical field of packaging for polishing wafers of optoelectronic materials. In particular, the present invention relates to a cleaning process of a polishing wafer carrier box. Background technique [0002] The processing of optoelectronic materials generally mainly includes the processes of material growth-cutting-slicing-chamfering-grinding-polishing-cleaning-packaging. After the processed polishing sheet is cleaned and spin-dried, the surface inspection is required. The qualified polishing sheet is placed in a slide box and packaged, and then processed into the required functional material through the next process. For example, the infrared cut filter is an optical filter that uses precision optical coating technology to alternately coat high and low refractive index optical films on optical glass to achieve high transmittance in the visible light region (400~630nm) and near infrared (700~1100nm) cutoff optical fil...

Claims

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Application Information

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IPC IPC(8): B08B3/12B08B9/28B08B7/04F26B21/00
CPCB08B3/12B08B9/28F26B21/00
Inventor 柳祝平周李姚文黄小卫
Owner 无锡长三角光电新材料有限公司
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