Apparatus for removing photoresist at edge of substrate

Abstract

The invention relates to the technical field of an apparatus for removing a photoresist, and discloses an apparatus for removing the photoresist at edge of a substrate. The apparatus for removing the photoresist at edge of the substrate comprises a spray washing apparatus, the spray washing apparatus comprises a liquid nozzle for injecting a photoresist solvent and a gas nozzle for injecting gas, gas injected from the gas nozzle blows the photoresist solvent at the edge of the substrate to the outer side of the substrate, the gas nozzle and the liquid nozzle are respectively the slit-shape gas nozzle and the slit-shape liquid nozzle; the gas injected from the slit-shape gas nozzle is fallen on the surface of the substrate to form a first slit zone, the liquid injected from the slit-shape liquid nozzle is fallen on the surface of the substrate to form a second slit zone, and the first slit zone and the second slit zone are not overlapped. According to the technical scheme, by employing the slit-shape gas nozzle or the slit-shape liquid nozzle, gas or liquid is smoothly injected, sputtering of the photoresist solvent can be avoided, and the generation of the adverse phenomenon of the substrate due to sputtering of the photoresist solvent in the substrate can be avoided.

Description

technical field [0001] The invention relates to the technical field of photoresist removal equipment, in particular to a device for removing photoresist at the edge of a substrate. Background technique [0002] Among the flat panel display devices, Thin Film Transistor Liquid Crystal Display (TFT-LCD) has the characteristics of small size, low power consumption, relatively low manufacturing cost and low radiation, and occupies a dominant position in the current flat panel display market. leading position. [0003] In the manufacturing process of TFT-LCD, the array process (Array) mainly consists of three major processes, namely deposition (Deposition) process, mask (Mask) process and etching (Etch) process. In the masking process, a layer of photoresist (Photo Resist, also known as photoresist) is uniformly coated on the substrate that has undergone the deposition process, and the thin film transistor pattern (TFT -pattern), and finally through the etching process to etch ...

AI Technical Summary

Problems solved by technology

However, in the process of removing the photoresist at the edge of the substrate, the pinhole of the needle nozzle is too thin, it is easy to block after foreign matter enters, and it is also easy to deform when encountering an external force. After the gas nozzle is blocked or deformed, the photoresist dissolver cannot be blown to the substrate in time. In addition, after the liquid nozzle is blocked or deformed, the resistance of the photoresist dissolver is too large when sprayed, and splashing is more likely to occur

Moreover, when the photoresist dissolving agent is sputtered to the position inside the substrate where the photoresist does not need to be removed, the photoresist at this position is dissolved, and the film layer at this position is etched away in the subsequent etching process, and then Defective spots are formed on the substrate, resulting in defective panels

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