A gas shower head for a plasma reactor

Abstract

The invention provides a gas spray head used for a plasma reactor. The gas spray head comprises gas distribution plates of an upper layer and a lower layer; a plurality of gas holes with corresponding positions are arranged in the gas distribution plates; the gas holes are isolated into different regions for providing reaction gas for different regions of the plasma reactor; an isolation ring in the different separation regions separates the first gas hole group and the second gas hole group; the isolation ring comprises an isolation groove and an isolation washer located in the isolation groove; and the compression height of the isolation washer is no more than 5% after the gas distribution plate of the upper layer and the gas distribution plate of the lower layer are closely attached by a fastening device.

Description

technical field [0001] The invention relates to the field of plasma processing, in particular to a gas shower head structure for a plasma reactor. Background technique [0002] In the manufacturing process of semiconductor devices, such as etching, deposition, oxidation, sputtering, etc., substrates (semiconductor wafers, glass substrates, etc.) are usually treated with plasma. Generally, plasma processing apparatuses include capacitively coupled plasma reactors and inductively coupled plasma reactors as methods for generating plasma in high frequency discharge plasma processing apparatuses. The capacitively coupled reactor is usually configured with an upper electrode and a lower electrode, preferably these two electrodes are arranged in parallel. In addition, usually, a substrate to be processed is placed on the lower electrode, and a high-frequency power source for plasma generation is applied to the upper electrode or the lower electrode via an integrator. The external...

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Problems solved by technology

However, thicker gaskets not only ensure gas isolation, but also make the contact pressure between the upper and lower plates insufficient or there is a gap, and the gap between the upper and lower plates will cause a sharp deterioration in the thermal conductivity between the upper and lower plates , eventually leading to uneven temperature distribution on the entire gas shower head

Uneven temperature distribution of the gas shower head will cause device deformation, and uneven distribution of deposited polymer during plasma treatment, which will lead to uneven plasma treatment effect

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