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Resin composition for base material of solar backboard

A technology of resin composition and solar back sheet, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of poor electrical insulation, easy embrittlement, poor shrinkage rate of modified polypropylene compositions, etc., and achieves a simple preparation method. The effect of easy operation, low water vapor transmission rate, excellent electrical insulation

Active Publication Date: 2014-07-02
SUZHOU DUCHAMPS ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since polyester is a polymer that is not resistant to hydrolysis, even with these improved technologies, it is still difficult to meet the moisture and heat aging resistance performance requirements of solar backsheets.
In the Chinese invention patent application CN102365172A, a new type of laminated polyester film added with rutile titanium oxide particles is proposed, but its adhesion with the adjacent EVA film cannot be guaranteed, and the following problems still exist: On the one hand, the fluorine-containing film layer is expensive, on the other hand, there is still a polyester film in the structure, which cannot change the problem that the solar backsheet is not resistant to heat and humidity, has high water absorption, poor electrical insulation, and is easy to embrittle.
However, the material is only used as the upper and lower layers of the back sheet, covering the upper and lower surfaces of the PET film to make a back sheet; it is not used as a back sheet substrate
In addition, actual tests have found that the above-mentioned modified polypropylene composition has poor shrinkage and cannot be directly used as a solar backsheet substrate

Method used

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  • Resin composition for base material of solar backboard
  • Resin composition for base material of solar backboard
  • Resin composition for base material of solar backboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] 75 parts (parts by weight) of block copolymer polypropylene K8303 (Beijing Yanshan Petrochemical Company, whose melt flow rate is 2.0 g / 10min at 230 °C / 2.16 kg) and 25 parts of high-density polyethylene 5000S (Beijing Yanshan Petrochemical Company, Its 190°C / 2.16kg melt flow rate is 0.8g / 10min) are measured separately and uniformly mixed, put into a twin-screw extruder for melt extrusion granulation;

[0027] The twin-screw adopts exhaust screw, the screw diameter is 75mm, the aspect ratio is 33, the screw temperature is controlled at 160~220°C, the screw speed is controlled at 100 rpm, and the residence time of the material in the screw is 2~4 minutes. After the material is cooled, granulated and dried, it becomes the finished resin composition S1. Its melt flow rate at 230°C / 2.16kg is 1.0g / 10min. The material performance test is shown in Table 1.

[0028] The block copolymer polypropylene K8303 is a block copolymer polypropylene produced by Beijing Yanshan Petrochemic...

Embodiment 2

[0031] 67 parts of block copolymerized polypropylene K8303 and 33 parts of high-pressure polyethylene 5000S were measured and uniformly mixed, and put into a twin-screw extruder for melt extrusion granulation. The twin-screw adopts exhaust screw, the screw diameter is 75mm, the aspect ratio is 33, the screw temperature is controlled at 160~220°C, the screw speed is controlled at 100 rpm, and the residence time of the material in the screw is 2~4 minutes. After the material is cooled, granulated and dried, it becomes the finished product S2. Its melt flow rate at 230°C / 2.16kg is 0.8g / 10min. The material performance test is shown in Table 1.

Embodiment 3

[0033] 50 parts of block copolymerized polypropylene K8303 and 50 parts of high-pressure polyethylene 5000S were measured and mixed uniformly, and put into a twin-screw extruder for melt extrusion granulation. The twin-screw adopts exhaust screw, the screw diameter is 75mm, the aspect ratio is 33, the screw temperature is controlled at 160~220°C, the screw speed is controlled at 100 rpm, and the residence time of the material in the screw is 2~4 minutes. After the material is cooled, granulated and dried, it becomes the finished product S3. Its melt flow rate at 230°C / 2.16kg is 0.9g / 10min. The material performance test is shown in Table 1.

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Abstract

The invention discloses a resin composition for a base material of a solar backboard. The resin composition comprises the following components in parts by weight: 100 parts of component A and 20-100 parts of component B, wherein the component A is homo-polypropylene, segmented co-polypropylene or the mixture of homo-polypropylene and segmented co-polypropylene; the DSC (differential scanning calorimetry) melting point of the component A is 160-165 DEG C, and the melt flow rate is 1-2g / 10 minutes; the component B is homo-polyethylene, co-polyethylene or the mixture of homo-polyethylene and co-polyethylene; the DSC (differential scanning calorimetry) melting point of the component B is 120-135 DEG C, the melt flow rate is 1-2g / 10 minutes, and the density is 0.941-0.959 g / cm<3>. The base material of the solar backboard prepared from the novel resin composition developed by the invention has excellent low-temperature resistance, damp-heat aging resistance and electrical insulating performance and low saturated water absorption rate and water vapor permeability, and can be used for replacing an existing BOPET (biaxially oriented polyester film).

Description

technical field [0001] The invention relates to a resin composition and a preparation method for a solar back plate base material, which can be used to prepare a solar cell back plate. Background technique [0002] Solar energy is the most abundant renewable energy resource, with unique advantages and huge potential for development and utilization. Solar power generation is a new technology in the way of solar energy utilization. Its power generation principle is to use the quantum effect of semiconductors such as silicon to directly convert the light energy of sunlight into electrical energy. However, if the silicon wafer is directly exposed to the atmosphere, its photoelectric conversion function will be attenuated. Therefore, in the prior art, EVA (ethylene-vinyl acetate copolymer) film is generally used as the packaging material to encapsulate the silicon wafer, and it is bonded with the upper protective material (such as low-iron tempered glass) and the lower protectiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/12C08L53/00C08L23/06C08L23/08C08K13/06C08K9/06C08K3/22C08K3/34C08K7/14C08K7/06C08K3/26C08K3/04B29C47/92H01L31/049B29C48/92
CPCB29C47/0004B29B7/72B29B7/46B29C2947/92685B29C47/0021B29B7/7461B29C47/065B29C47/92B29B9/14B29C2947/92485B29B9/06B29B7/90B29B9/12B29C48/022B29C48/08B29C48/21B29C48/92B29C2948/92209B29C2948/92485B29C2948/926B29C2948/92685B29C2948/92704C08K2003/2241C08L53/00C08K2201/014C08L23/06C08L23/08C08L23/12C08L2201/08C08L2203/16C08L2203/204C08L2207/062C08L2207/066C08K9/06C08K3/34
Inventor 罗吉江符书臻
Owner SUZHOU DUCHAMPS ADVANCED MATERIALS CO LTD
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