Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip packaging and radiating mode

A heat dissipation method and chip packaging technology, which is applied to electrical components, electric solid devices, circuits, etc., can solve problems such as increased chip temperature, reduced heat dissipation efficiency of heat sinks, and reduced chip life, so as to increase the heat dissipation surface area and reduce the surface area. , the effect of improving stability

Active Publication Date: 2014-06-18
JIANGXI CHUANGCHENG MICROELECTRONICS CO LTD
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In some occasions, the heating power of the chip causes the temperature of the chip to rise, which in turn leads to a decrease in the life of the chip. In order to reduce the temperature of the chip, people usually attach a heat sink on the surface of the chip to dissipate heat. Exposure to the air for a long time, more and more dust will accumulate on the surface of the heat sink, which will reduce the heat dissipation efficiency of the heat sink

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip packaging and radiating mode
  • Chip packaging and radiating mode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present invention.

[0018] refer to figure 1 and figure 2 As shown, a chip package heat dissipation method, the chip package structure prepared by this method includes a chip body 1, a polymer packaging material layer 2 and at least two thermal bimetallic sheet components, and the chip package heat dissipation method includes the following thermal bimetallic sheets Components and steps:

[0019] The thermal bimetal component includes a thermal bimetal and a silicon rubber layer, the active layer 3 of the thermal bimetal is close to the passive layer 4 of the thermal bimetal, and the active layer 3 or passive layer 4 of the thermal bimetal is close to the chip body 1 The surface of the thermal bimetal sheet i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a chip packaging and radiating mode. A chip packaging structure prepared through the mode comprises a chip main body, a macromolecule packaging material layer and at least two thermal bimetallic strip assemblies. The chip packaging and radiating mode has the beneficial effects that the radiating surface area is increased when chips emit heat, and the radiating surface area is reduced when the chips do not emit heat, so that dust accumulated on the surfaces of the chips is reduced, and the radiating efficiency of the packaging structure is improved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a heat dissipation method for chip packaging. Background technique [0002] In some occasions, the heating power of the chip causes the temperature of the chip to rise, which in turn leads to a decrease in the life of the chip. In order to reduce the temperature of the chip, people usually attach a heat sink on the surface of the chip to dissipate heat. In the long-term exposure to air, more and more dust will accumulate on the surface of the heat sink, which will reduce the heat dissipation efficiency of the heat sink. Contents of the invention [0003] The invention provides a new heat dissipation mode for chip packaging, so that when the chip generates heat, the heat dissipation area increases, and when the chip stops working, the heat dissipation area decreases, thereby reducing the accumulation of dust on the surface of the heat sink. [0004] In order to achieve t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/28H01L23/29H01L23/31H01L23/373H01L23/367
Inventor 苏少爽王雪松游平
Owner JIANGXI CHUANGCHENG MICROELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com