Non-normal temperature test module

Abstract

The invention discloses a non-normal temperature test module, which comprises a base, a bracket and a motor mounted on the base, a fixed seat supported by the bracket, a turntable connected to the motor, and a plurality of fixtures mounted on the turntable. The fixed seat is provided with a plurality of mounting seats corresponding to the fixtures, and the mounting seats are provided with high temperature warehouses. The non-normal temperature test module provided by the invention can reduce the machine space occupation, can make the product operate under a thermal insulation condition, and can control the heating time and temperature to meet the requirements of different heating tests.

Description

technical field [0001] The invention relates to a turntable semiconductor heating test sorter, in particular to a very high temperature test module. Background technique [0002] In the semiconductor testing and packaging industry, the heating test is a stability test for semiconductor products to simulate high-temperature operation, and a visual inspection (2D, 3D) of the appearance of semiconductor products after heating. Therefore, the turntable semiconductor heating test sorter Semiconductor products can be fed into standard material tubes. After heating tests and product appearance inspections (2D, 3D), good products go directly to the discharge station, and defective products are screened through testing and light inspection before entering the sorting tube. [0003] However, the test packaging machine of the existing turntable semiconductor heating test sorter only has the function of normal temperature test, and does not have the function of high temperature test. T...

AI Technical Summary

Problems solved by technology

The high-temperature testing machine on the market can only reach 80°C, and the high-temperature testing station operates in an open space. Because the space is open, it will be subject to external interference and cause large temperature fluctuations, so it cannot reach the high-temperature test. Requirements (high temperature test requires temperature difference between ±3~5℃)

In addition, the high temperature test needs to heat the components to a certain temperature, and the open high temperature test station takes a long time to heat up

[0004] In addition, the original equipment uses pressure rods to fix the components, so the material requirements for the pressure rods are relatively high, and the airtightness cannot be well controlled during high temperature tests

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