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T/R assembly integrated air tightness packaging structure resistant to overload

An encapsulation structure and air tightness technology, which can be applied to antenna supports/installation devices, semiconductor/solid-state device parts, electrical components, etc. Complex structure and other problems, to achieve the effect of improving microwave characteristics, improving reliability, and shortening transmission distance

Active Publication Date: 2014-05-28
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Disadvantages: Conventional RF / microwave T / R components and receiving / transmitting antennas are installed separately, the integration level is relatively low, the component structure is more complex, the ability to withstand high overload is poor, and it is difficult to use coaxial cables to achieve airtight packaging

Method used

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  • T/R assembly integrated air tightness packaging structure resistant to overload
  • T/R assembly integrated air tightness packaging structure resistant to overload
  • T/R assembly integrated air tightness packaging structure resistant to overload

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with the drawings. The following embodiments are only used to illustrate the technical solutions of the present invention more clearly, and cannot be used to limit the protection scope of the present invention.

[0028] The invention adopts a specially designed circular metal shell 1, the receiving / transmitting antenna and the signal processing unit are respectively arranged on both sides of the shell, and the microwave insulator is used for signal transmission between the two parts, and the microwave insulator is sintered on the shell by eutectic welding. , The signal processing unit is an airtight structure, and the shell can be packaged by parallel seam welding or laser welding. The intermediate frequency signal output and control signal input of the T / R component adopts L-shaped pins, and the signal processing unit substrate adopts wire bonding Interconnected, the process flow is like Image 6 Shown....

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Abstract

The invention discloses a T / R assembly integrated air tightness packaging structure resistant to overload. The T / R assembly integrated air tightness packaging structure resistant to overload comprises a cylindrical shell, a groove used for containing an antenna is formed in one end of the shell, the other end of the shell is provided with a cavity used for containing a signal processing unit, and the cavity is sealed by a cover board. An installation hole used for installing a microwave insulator is reserved in the portion, clamped between the groove and the cavity, of the shell and the microwave insulator is arranged in the installation hole through eutectic welding. Wires on the two sides of the microwave insulator are connected with the antenna and a signal processing unit substrate respectively. According to the T / R assembly integrated air tightness packaging structure resistant to overload, miniaturization and integration of a radio frequency / microwave T / R assembly are achieved. The microwave insulator is sintered on the metal shell in a gold-tin eutectic welding mode and matched with parallel seam welding (or laser welding) air tightness packaging, the sealing performance of a cavity of the signal processing unit can be guaranteed, and the reliability of the assembly can be improved. Transmission between the sending / receiving antenna and the signal processing unit is conducted through the microwave insulator, the transmission distance is shortened, and the microwave characteristic of a circuit is improved.

Description

[0001] Technical field [0002] The invention relates to a T / R (transmitting and receiving) component integrated airtight packaging structure, which belongs to the technical field of circuits. Background technique [0003] Traditional RF / microwave T / R component packaging technology generally assembles low-end amplifiers, mixers, intermediate frequency amplifiers and other parts in the housing of the signal processing unit. The signal processing unit performs signals through a coaxial cable and a receiving / transmitting antenna. transmission. [0004] Disadvantages: Conventional RF / microwave T / R components and receiving / transmitting antennas are installed separately, with relatively low integration, complex component structure, and poor high overload resistance. It is difficult to use coaxial cables to achieve airtight packaging. Summary of the invention [0005] The technical problem to be solved by the present invention is to provide an overload-resistant T / R component integrated ai...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/04H01L23/06H01L23/02H01Q1/22H04B1/38
CPCH01L2224/45144H01L2224/48091H01L2924/19107
Inventor 李杰潘结斌杜松刘昕车勤
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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