An overload-resistant t/r component integrated hermetic packaging structure

Abstract

The invention discloses a T / R assembly integrated air tightness packaging structure resistant to overload. The T / R assembly integrated air tightness packaging structure resistant to overload comprises a cylindrical shell, a groove used for containing an antenna is formed in one end of the shell, the other end of the shell is provided with a cavity used for containing a signal processing unit, and the cavity is sealed by a cover board. An installation hole used for installing a microwave insulator is reserved in the portion, clamped between the groove and the cavity, of the shell and the microwave insulator is arranged in the installation hole through eutectic welding. Wires on the two sides of the microwave insulator are connected with the antenna and a signal processing unit substrate respectively. According to the T / R assembly integrated air tightness packaging structure resistant to overload, miniaturization and integration of a radio frequency / microwave T / R assembly are achieved. The microwave insulator is sintered on the metal shell in a gold-tin eutectic welding mode and matched with parallel seam welding (or laser welding) air tightness packaging, the sealing performance of a cavity of the signal processing unit can be guaranteed, and the reliability of the assembly can be improved. Transmission between the sending / receiving antenna and the signal processing unit is conducted through the microwave insulator, the transmission distance is shortened, and the microwave characteristic of a circuit is improved.

Description

technical field [0001] The invention relates to an integrated airtight packaging structure of T / R (transmitting and receiving) components, which belongs to the technical field of circuits. Background technique [0002] The traditional RF / microwave T / R component packaging technology generally assembles low-end amplifiers, mixers, intermediate frequency amplifiers, etc. transmission. [0003] Disadvantages: Conventional RF / microwave T / R components and receiving / transmitting antennas are installed separately, the integration level is relatively low, the component structure is relatively complex, and the ability to withstand high overload is poor. It is difficult to use coaxial cables to achieve airtight packaging. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide an overload-resistant integrated airtight package structure of T / R components, which has high integration, good sealing and overload resistance. [0005] I...

AI Technical Summary

Problems solved by technology

[0003] Disadvantages: Conventional RF / microwave T / R components and receiving / transmitting antennas are installed separately, the integration level is relatively low, the component structure is more complex, the ability to withstand high overload is poor, and it is difficult to achieve airtight packaging with coaxial cables

Images