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Technology for producing high-frequency microwave copper-clad plate with dielectric constant of 3.4

A high-frequency microwave and dielectric constant technology, applied in the direction of layered products, metal layered products, synthetic resin layered products, etc., can solve the problem of poor adhesion between metal copper and hole walls, complex metallization process, and in-hole lines Disconnection and other problems, to achieve the effect of good mechanical performance, low cost, and little environmental pollution

Inactive Publication Date: 2014-05-28
TONGLING HAORONG ELECTRONICS TECH
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

The high-frequency copper-clad laminates currently on sale at home and abroad are mainly based on PTFE resin glue matrix, but the PTFE resin glue matrix has a big defect, that is, the metallization process in the hole is complicated when the circuit board is made, and the pass rate is low. , the fatal defect is that the metal copper has poor adhesion to the hole wall and is easy to fall off, which leads to the disconnection of the line in the hole

Method used

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  • Technology for producing high-frequency microwave copper-clad plate with dielectric constant of 3.4

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Experimental program
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Embodiment Construction

[0021] 1. Polyphenylene ether resin glue solution modification:

[0022] Raw materials and ratio

[0023] Material Proportion amount (g) toluene 315-330 Allyl Bisphenol A 1.40-1.50 Polyphenylene ether 90.0-105.0 Benzoyl peroxide 2.20-2.35 triallyl cyanate 17.00-17.45 dicumyl peroxide 48.0-51.5 Decabromodiphenylethane 14.5-16.0 Antimony trioxide 5.5-6.2

[0024] First dissolve polyphenylene ether and benzoyl peroxide with toluene, after mixing, add allyl bisphenol A; keep the solution warm for reaction; then add dicumyl peroxide and triallyl cyanate to continue the reaction; After the reaction is completed, the resin glue is cooled immediately; finally, the composite flame retardant decabromodiphenylethane and antimony trioxide are added, and the resin glue is evenly stirred to obtain the resin glue;

[0025] Resin glue control index: gelation time: 125±15 seconds

[0026] Viscosity: 21±4 seconds,

[0027] Solid ...

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Abstract

The invention discloses a technology for producing a high-frequency microwave copper-clad plate with a dielectric constant of 3.4. The technology comprises the following steps: dissolving modifying polyphenyl ether resin, dip-coating a glass fabric, stacking with a copper foil, laminating at high temperature and high pressure, testing performance and cutting packages, wherein a crosslinked body with an appropriate molecular weight is formed by the allylation modification of the polyphenyl ether resin, then the glass fiber fabric is dipped in the crosslinked body to form a prepreg, and the prepreg is laminated together with the copper foil to produce the high-frequency copper-clad plate.

Description

technical field [0001] The invention relates to a process for producing high-frequency microwave copper-clad laminates with a dielectric constant of 3.4. Background technique [0002] Dielectric constant 3.4 High-frequency microwave copper clad laminate is the basic material and one of the necessary materials for high information transmission and communication. It is made of glass cloth prepreg and copper foil impregnated with low dielectric constant resin glue polyphenylene ether. High-performance, high-tech composite materials made of high-pressure and high-temperature composites. [0003] The resin glue systems that can be used in the high-frequency communication field include polytetrafluoroethylene (PTFE), polyphenylene ether, and cyanate resin glue solutions, but the existing products at home and abroad are mainly PTFE and polyphenylene ether resin glue systems. host. The high-frequency copper-clad laminates currently on sale at home and abroad are mainly based on PT...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B15/20B32B27/04B32B27/18B32B37/10C08L71/12C08K13/02C08K5/14C08K5/3492C08K5/03C08K3/22C08J3/24
Inventor 曹慧妍
Owner TONGLING HAORONG ELECTRONICS TECH
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