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Composite type flexible pressure and displacement sensitive element and preparation method thereof

A displacement sensitive and composite technology, applied in the field of measurement, can solve the problems of limited application, inability to realize pressure measurement, inability to complete non-contact displacement measurement, etc., and achieve the effect of saving installation space, thin thickness and high flexibility

Inactive Publication Date: 2014-04-23
NORTHEASTERN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, this composite material can be used as a sensitive material for flexible pressure sensors, but this method cannot complete non-contact displacement measurement
On the other hand, using the eddy current effect of planar coils can realize non-contact displacement measurement, but this method cannot realize pressure measurement
At present, scientific research institutions at home and abroad generally use the above two sets of sensing systems to complete pressure measurement and non-contact displacement measurement. Therefore, two types of sensing probes and two sets of signal processing systems are required, which limits the pressure between layers on narrow curved surfaces. Applications such as displacement measurement

Method used

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  • Composite type flexible pressure and displacement sensitive element and preparation method thereof
  • Composite type flexible pressure and displacement sensitive element and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0016]A via hole with a diameter of 300 microns is opened on a polyimide film with a thickness of 12.5 microns, and a copper foil with a thickness of 10 microns is laminated on the front and back surfaces of the polyimide film and the via holes, and the front copper foil is treated. Photolithography, forming a copper foil coil centered on the via hole, forming an edge lead on the end side of the copper foil coil, performing photolithography on the reverse copper foil to form a center lead 5, and then completing the preparation of the displacement sensitive layer, the copper foil The shape of the coil is circular, the number of turns is 50, the line width is 0.15 microns, and the line distance is 0.3 microns. The carbon nanotube powder with an aspect ratio of 100 and polydimethylsiloxane are used in a mass ratio of 0.04:1. mixed, and added to n-hexane to form a carbon nanotube / polydimethylsiloxane / n-hexane mixed solution, and the carbon nanotube / polydimethylsiloxane / n-hexane mix...

Embodiment 2

[0018] A via hole with a diameter of 300 microns is opened on a polyimide film with a thickness of 12.5 microns, and a copper foil with a thickness of 10 microns is laminated on the front and back surfaces of the polyimide film and the via holes, and the front copper foil is treated. Photolithography, forming a copper foil coil centered on the via hole, forming an edge lead on the end side of the copper foil coil, performing photolithography on the reverse copper foil to form a center lead 5, and then completing the preparation of the displacement sensitive layer, the copper foil The shape of the coil is circular, the number of turns is 80, the line width is 0.3 microns, and the line distance is 0.3 microns. Graphene powder with a specific surface area of ​​50 square meters per gram and polyethylene are mixed in a mass ratio of 0.04:1, and It is added to n-hexane to form a graphene / polyethylene / n-hexane mixed solution, and the graphene / polyethylene / n-hexane mixed solution is su...

Embodiment 3

[0020] A via hole with a diameter of 300 microns is opened on a polyimide film with a thickness of 12.5 microns, and a copper foil with a thickness of 10 microns is laminated on the front and back surfaces of the polyimide film and the via holes, and the front copper foil is treated. Photolithography, forming a copper foil coil centered on the via hole, forming an edge lead on the end side of the copper foil coil, performing photolithography on the reverse copper foil to form a center lead 5, and then completing the preparation of the displacement sensitive layer, the copper foil The shape of the coil is circular, the number of turns is 60, the line width is 0.15 microns, and the line distance is 0.15 microns. Carbon black powder and resin with a specific surface area of ​​780 square meters per gram are mixed in a mass ratio of 0.06:1, and the It is added to n-hexane to form a carbon black / resin / n-hexane mixed solution, and the carbon black / resin / n-hexane mixed solution is mech...

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Abstract

The invention relates to a composite type flexible pressure and displacement sensitive element and a preparation method thereof, and belongs to the technical field of measurement. The composite type flexible pressure and displacement sensitive element comprises a displacement sensitive layer, a pressure sensitive layer and an insulated encapsulation layer, wherein the displacement sensitive layer is formed by a copper foil coil covering a polyimide film; the pressure sensitive layer is formed by a conductive polymer composite material which is embedded in Polydimethyl Siloxane; the insulated encapsulation layer is formed by a flexible polymer material which is vulcanized at the outer parts of the displacement sensitive layer and the pressure sensitive layer; information of pressure and displacement can be obtained through detecting the impedance change of the copper foil coil. The composite type flexible pressure and displacement sensitive element prepared by the invention has dual functions of pressure measurement and non-contact displacement measurement and can be applied to the fields of multi-sensitive electronic skin preparation or pressure measurement and non-contact displacement measurement between small narrow curved layers of a whole machine and complete equipment in an intelligent manufacturing complete process.

Description

technical field [0001] The invention belongs to the field of measurement technology, in particular to the development of soft pressure and displacement sensors. Background technique [0002] With the development of modern science and technology, the shapes of many key core components and key basic components of the whole machine and complete sets of equipment in the whole process of intelligent manufacturing are becoming more and more complex, and the requirements for assembly and positioning accuracy are also getting higher and higher. In order to improve the assembly speed of major equipment, obtain the best assembly state, and ensure the safety of product storage, it is necessary to measure the pressure and displacement between the surfaces of revolution, but limited by the size of the site space structure and the special conditions such as the measured environment and medium, it is very difficult Difficult to install traditional rigid sensors. Therefore, there is an urg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02
Inventor 王璐珩
Owner NORTHEASTERN UNIV
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