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Chemical palladium immersing solution

A palladium immersion and chemical technology, which is applied in the field of chemical immersion (immersion) palladium solution, can solve the adverse effects of surface palladium layer inhomogeneity chemical gold plating, difficult to control the thickness and other problems, to improve the solderability and conductivity of the coating, life expectancy The effect of shortening and uniform coating

Inactive Publication Date: 2014-04-16
CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the plating solution is used continuously, the plating rate of palladium changes with time, and it is difficult to control the thickness
[0006] The electroless palladium plating solution disclosed in the patent document CN 101709462B can plate a layer of dense palladium on the nickel surface, but the inhomogeneity of the surface palladium layer has a bad influence on the subsequent electroless gold plating

Method used

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  • Chemical palladium immersing solution
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Bath composition

[0045] Pd(NH 3 ) 2 Cl 2 / g·L -1 1.6 (as palladium)

[0046] Ethylenediamine / mL·L -1 50

[0047] Citric acid / g·L -1 15

[0048] OP-10 ml / L 0.01

[0049] Adjust the pH of the plating solution to 5.80 with ammonia water, and immerse the 20×30mm pre-nickel-plated printed circuit board in the plating solution for 30 minutes, and the temperature of the plating solution is 40°C. As a result, a flat palladium film with an average thickness of 6.7 μm was produced. The palladium film is observed under a 10000 scanning electron microscope, and it can be observed that the surface of the palladium film is even and smooth. At the same time, when the plating solution was cooled, the measured pH was 5.75, and the pH change was very small. The MTO of palladium is greater than 3.

Embodiment 2

[0051] Bath composition

[0052] Pd(NH 3 ) 4 Cl 2 / g·L -1 0.1 (as palladium)

[0053] Ethylenediamine / mL·L -1 40

[0054] Nitrilotriacetic acid / g·L – 1 20

[0055] Citric acid / g·L -1 2

[0056] OP-10 ml / L 0.1

[0057] Adjust the pH of the plating solution to 3.00 with ammonia water, and immerse a 20×30mm nickel-plated printed circuit board in the plating solution for 30 minutes, and the temperature of the plating solution is 40°C. As a result, a flat palladium film having an average thickness of 1.1 µm was produced. The palladium film was observed under a 10000 scanning electron microscope to be even and smooth. At the same time, when the plating solution was cooled, the measured pH was 2.95, and the pH change was very small. The MTO of palladium is greater than 4.

Embodiment 3

[0059] Bath composition

[0060] PdCl 2 / g·L -1 0.6 (calculated as palladium)

[0061] Ethylenediamine / mL·L -1 30

[0062] Ammonium chloride / g·L – 40

[0063] HNO 2 ml / L 0.2

[0064] The pH of the plating solution was adjusted to 5.79 with hydrochloric acid, and a 20×30mm nickel-plated printed circuit board was immersed in the plating solution for 30 minutes, and the temperature of the plating solution was 40°C. As a result, a flat palladium film with an average thickness of 2.1 μm was produced. The palladium film was observed under a 10000 scanning electron microscope to be even and smooth. At the same time, when the plating solution was cooled, the measured pH was 5.45, and the pH change was very small. The plating solution was operated continuously for 15 hours, the bath solution was stable, and the deposition rate was stable. The MTO ...

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Abstract

The invention relates to a chemical palladium immersing / palladium replacement plating solution, and particularly relates to a chemical palladium immersing solution which is capable of directly forming a palladium film with good adhesiveness on a chemical nickel plating coating film formed in a PCB (Printed Circuit Board). The chemical palladium immersing solution does not influence a chemical nickel plating film as a base film. The chemical palladium immersing solution contains a soluble palladium salt, a first complexing agent, a second complexing agent, a pH regulating agent and a brightening agent. The first complexing agent is one or more of ammonia and diamine, and the second complexing agent is one or more of amino carboxylic acid compounds and hydroxy carboxylic acid compounds. The chemical palladium immersing solution has the characteristics of stable pH, stable deposition rate, long bath service life and excellent bath stability; a uniform and flat palladium plating film with excellent solder connectivity and lead weldability can be obtained.

Description

technical field [0001] The invention relates to a chemical immersion palladium solution, more particularly to a chemical immersion palladium solution capable of directly forming a palladium film with good adhesion on an electroless nickel plating film formed on a PCB printed circuit board. Background technique [0002] The surface of the packaging carrier and other printed circuit boards has been treated with electroless nickel plating, chemical immersion palladium, and immersion gold (ENIPIG), and has obtained the technical performance of nickel / palladium / gold coating, which has excellent solderability, linearity, Flatness, oxidation resistance, heat resistance and long-term reliability, etc. Palladium and gold have different deposition hardness and melting point, but both have superior oxidation resistance and stable performance in high temperature and high humidity atmosphere. [0003] Electroless palladium and palladium alloys have been developed as a more economical al...

Claims

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Application Information

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IPC IPC(8): C23C18/42
Inventor 肖忠良高洁吴道新许国军周英刘青桥周清清李仙清刘军朱梦
Owner CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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