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Laser splitting galvanometer scanning and processing device

A galvanometer scanning and processing device technology, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of low processing efficiency and slow processing speed, and achieve improved processing efficiency, high processing speed and processing accuracy, The effect of improving the efficiency and quality of laser processing

Active Publication Date: 2014-04-09
张立国
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a laser beam splitting galvanometer scanning processing device, which solves the technical problems of low processing efficiency and slow processing speed of the laser processing device in the prior art

Method used

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  • Laser splitting galvanometer scanning and processing device
  • Laser splitting galvanometer scanning and processing device
  • Laser splitting galvanometer scanning and processing device

Examples

Experimental program
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Effect test

Embodiment 1

[0054] figure 1 It is a schematic diagram of the structure of the laser beam splitting galvanometer scanning processing device used in the laser marking of the stainless steel light guide plate mask, such as figure 1 As shown: the stainless steel light guide plate mask laser marking device of this embodiment includes an incident light beam 1, a beam control module, a laser beam splitting module 3 and a galvanometer scanning focusing unit. The workpiece 14 to be processed is a stainless steel sheet with a thickness of 200 microns.

[0055] The beam control module includes a laser beam expanding unit 2, and the galvanometer scanning and focusing unit includes a scanning galvanometer and a scanning plan focusing lens. The scanning plan focusing lens includes a common plan scanning focusing lens and a telecentric plan scanning focusing lens. In this embodiment, the scanning plan focusing lens adopts a telecentric plan scanning focusing lens 12, and the telecentric scanning The focal l...

Embodiment 2

[0062] figure 2 It is a schematic diagram of the structure of a laser beam splitting galvanometer scanning processing device used in silicon wafer drilling according to the present invention, such as figure 2 As shown: including a beam control module, a laser beam splitting module and a galvanometer scanning and focusing module, the workpiece 34 to be processed is a polysilicon wafer with a thickness of 200 microns, which is fixedly installed on a linear moving platform.

[0063] The beam control module of this embodiment includes a laser beam expanding unit 19 and a beam dynamic control unit.

[0064] The incident beam 18 in this embodiment is an incident expanded collimated beam with a diameter of 10 mm. The relevant parameters are as follows: laser wavelength 532 nanometers, beam quality factor less than 1.2, spot roundness greater than 90%, and average power 35 watts , Single-mode Gaussian laser (the transverse field strength is Gaussian distribution), and the pulse repetition...

Embodiment 3

[0075] Such as image 3 Shown is a structural schematic diagram of the application of a laser beam splitting galvanometer scanning processing device in a stainless steel filter screen drilling of the present invention, including a beam control module, a laser beam splitting module, and a galvanometer scanning focusing module. The workpiece to be processed 54 It is a stainless steel sheet with a thickness of 100 microns.

[0076] The incident beam is an incident expanded collimated beam with a diameter of 10 mm, and its relevant parameters are as follows: laser wavelength 532 nanometers, beam quality factor less than 1.2, spot roundness greater than 90%, average power 30 watts, single mode Gaussian laser (the transverse field strength is Gaussian distribution), the pulse repetition frequency is 100 kHz.

[0077] The beam control module of this embodiment includes a laser beam expanding unit 38 and a beam dynamic control unit. The beam dynamic control unit includes a first incident ...

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Abstract

The invention relates to the field of laser processing, in particular to a laser splitting galvanometer scanning and processing device comprising a beam control module, a laser splitting module, and a galvanometer scanning and focusing module. The laser splitting module is capable of processing a single laser beam into multiple laser beams, and the galvanometer scanning and focusing module is capable of switching laser focuses at high speed; by combining the two modules, high-speed efficient precision array laser processing is achieved; beam motion track control contents in laser processing can be further enriched by adding the beam control module, and the needs of various processing environments and various conditions are met. Compared to traditional laser processing, the laser splitting galvanometer scanning and processing device has the advantages that all aspects such as processing precision, processing efficiency and processing quality are greatly improved, the device adapts to the development trend of modern solid-state lasers and the device is widely applicable to the field of laser processing.

Description

Technical field [0001] The invention relates to the field of laser processing, in particular to a laser beam splitting galvanometer scanning processing device. Background technique [0002] In the prior art, laser processing devices equipped with galvanometer scanning and focusing all use single-beam laser processing, and the processing efficiency is not high enough to meet industrial needs; while the devices that use multi-beam laser processing are based on static focusing methods. The problem of slow laser focus switching position. However, the current solid-state lasers, especially fiber lasers, are developing in the direction of high pulse repetition frequency and high-power ultra-short pulse width. The above-mentioned processing methods can no longer match the current development of solid-state lasers, and cannot give full play to the existing With the advantages of high pulse repetition frequency and high-power ultra-short pulse width of laser, a more efficient laser proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/064B23K26/082
CPCB23K26/064B23K26/0643B23K26/0648B23K26/0652B23K26/0676B23K26/082B23K26/707
Inventor 张立国
Owner 张立国
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