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A kind of treatment method before electroplating nickel of copper product

A treatment method and nickel electroplating technology, which is applied in the field of nickel electroplating of copper products, can solve problems such as yellowing or blackening of electroplating, short polishing time, incomplete polishing of local areas of copper products, etc., and achieve consistent surface color and good appearance , the effect of brightness improvement

Active Publication Date: 2016-08-17
YANGZHOU HY TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The original chemical corrosion composition contains a large amount of sulfuric acid, which is a strong oxidizing agent with nitric acid (oxidizing property: concentrated nitric acid > concentrated sulfuric acid), and will undergo a violent oxidation reaction with copper. During polishing, copper mainly reacts with sulfuric acid (sulfuric acid when proportioning The content is much greater than that of nitric acid), and the reaction is violent, and the polishing time is short, which may easily cause incomplete polishing of the local area of ​​the copper product, and cause yellowing or blackening during electroplating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) The copper product to be electroplated with nickel is polished for the first time at room temperature for 5 seconds, and then washed with water; wherein, the polishing liquid I used for the first polishing is composed of the following volume ratios: nitric acid: sulfuric acid :hydrochloric acid:water:cooling agent=1:12:0.05:28:2.5.

[0025] (2) After the first polishing and water washing, the copper product was polished for the second time at room temperature for 2 minutes, and then entered into three washing tanks for water washing with deionized water; wherein the second polishing used Polishing fluid II is composed of the following volume ratios: nitric acid: polishing fluid I: water: cooling agent = 1:1:7:1.

[0026] The decooling agent in the step (1) and step (2) is xylene with scouring agent added, wherein the amount of scouring agent added is 0.1L / kg, which is made by adding 1.5L scouring agent to 15 kg of xylene.

[0027] (3) Pickling the copper product af...

Embodiment 2

[0033] (1) The copper product to be electroplated with nickel is polished for the first time at room temperature for 8 seconds, and then washed with water; wherein, the polishing liquid I used for the first polishing is composed of the following volume ratios: nitric acid: sulfuric acid :hydrochloric acid:water:cooling agent=1:12:0.05:28:2.5.

[0034] (2) After the first polishing and water washing, the copper product was polished for the second time at room temperature for 2.5 minutes, and then entered into three water washing tanks for washing with deionized water; Polishing fluid II is composed of the following volume ratios: nitric acid: polishing fluid I: water: cooling agent = 1:1:7:1.

[0035] The decooling agent in the step (1) and step (2) is xylene with scouring agent added, wherein the amount of scouring agent added is 0.1L / kg, which is made by adding 1.5L scouring agent to 15 kg of xylene.

[0036] (3) Pickling the copper product after the second polishing and wat...

Embodiment 3

[0042] (1) The copper product to be electroplated with nickel is polished for the first time at room temperature for 10 seconds, and then washed with water; wherein, the polishing liquid I used for the first polishing is composed of the following volume ratio: nitric acid: sulfuric acid :hydrochloric acid:water:cooling agent=1:12:0.05:28:2.5.

[0043] (2) After the first polishing and water washing, the copper product was polished for the second time at room temperature for 3 minutes, and then entered into three water washing tanks for washing with deionized water; wherein the second polishing used Polishing fluid II is composed of the following volume ratios: nitric acid: polishing fluid I: water: cooling agent = 1:1:7:1.

[0044] The decooling agent in the step (1) and step (2) is xylene with scouring agent added, wherein the amount of scouring agent added is 0.1L / kg, which is made by adding 1.5L scouring agent to 15 kg of xylene.

[0045] (3) Pickling the copper product af...

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PUM

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Abstract

The invention relates to a treatment method for a copper product before electronickelling. The method comprises the following steps: firstly, polishing the copper product to be electroplated for the first time, and then washing; polishing for the second time, and then washing for three times; pickling, wherein a pickling solution for pickling is sulfuric acid of which the volume fraction is 30%; finally, activating to finish treatment, wherein the activating solution for activation is sulfuric acid of which the volume fraction is 3-5%. By adopting the treatment method, only oxide and greasy dirt on the surface of the copper product can be processed, and the copper layer is not corroded, so that the integrity of the product is greatly protected; meanwhile, the electroplated appearance is good in consistence, consistent in surface color and luster, and good in uniformity after electronickelling is carried out, and the brightness is improved.

Description

technical field [0001] The invention relates to a treatment method for copper products before electroplating nickel, and belongs to the field of copper product electroplating nickel technology. Background technique [0002] With the rapid development of electronic circuits, the importance of the nickel plating process has increased significantly. At present, most of the pre-treatments on the market are direct chemical corrosion (sulfuric acid and sodium thiosulfate) on copper materials, which can easily damage the surface of copper products. The original chemical corrosion composition contains a large amount of sulfuric acid, which is a strong oxidizing agent with nitric acid (oxidizing property: concentrated nitric acid > concentrated sulfuric acid), and will undergo a violent oxidation reaction with copper. During polishing, copper mainly reacts with sulfuric acid (sulfuric acid when proportioning The content is much greater than that of nitric acid), and the reaction i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/34C23F17/00C23F3/06C23G1/10
Inventor 方丁玉王秋旭薛明峰居文娟
Owner YANGZHOU HY TECH DEV
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