Cesium iodide scintillator screen and packaging method thereof

Abstract

The invention relates to a cesium iodide scintillator screen and a packaging method thereof. The cesium iodide scintillator screen comprises a reflection substrate, a cesium iodide scintillator layer deposited on the reflection substrate, a waterproof transparent film stitched on the upper surface of the cesium iodide scintillator layer, and a substrate layer adhered to the lower surface of the reflection substrate, wherein the peripheral edge of the cesium iodide scintillator layer is provided with a sealant, the lower surface of the sealant is attached to the reflection substrate, and the upper surface of the sealant is attached to the waterproof transparent film. Through such a mode, the cesium iodide scintillator screen can realize water blocking and waterproofing effects, enhances rigidity, employs a simple packaging process, substantially reduces scintillator packaging cost, and improves packaging efficiency.

Description

technical field [0001] The invention relates to the technical field of functional thin film materials, more specifically, the invention relates to a cesium iodide scintillator screen. Background technique [0002] Inorganic scintillator (inorganic scintillator) plays a very important role in radiation detection and is widely used in imaging nuclear medicine, nuclear physics, high energy physics, industrial CT, oil well exploration and safety inspection and other fields. At present, inorganic scintillators are the most researched and applied, among which cesium iodide scintillators with high brightness and high resolution are the most widely used. However, cesium iodide is a hygroscopic material. When it absorbs moisture in the air and deliquesces, the characteristics of the scintillator, especially the image resolution, will be greatly reduced. Therefore, how to effectively package the scintillator is even more important. And different substrates have different encapsulatio...

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Problems solved by technology

[0004] However, the use of CVD to evaporate parylene film and sputter SiO 2 The layer is used as a moisture-proof barrier to protect the scintillator from moisture. At least two kinds of equipment, namely CVD equipment and sputtering equipment, are required to complete the entire packaging process. It can be seen that this packaging method has the problems of complicated process and high production cost.

At the same time, using the evaporation method to package, it is necessary to process a mask to protect the places that do not need to be covered, such as connecting pins, etc., which greatly increases the complexity of the process

Moreover, the speed of forming an organic film protective layer of parylene by CVD is about 100 to 2000 angstroms / minute, so it takes 2000 minutes to 100 minutes to form a 20um scintillator protective layer. This existing packaging technology has a relatively low productivity. low problem

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