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A circuit board producing method for preventing golden fingers from exposing copper

A production method and circuit board technology, applied in the direction of electrical connection formation of printed components, etc., can solve the problems of low efficiency, poor effect of preventing gold finger copper leakage, and difficult implementation, so as to achieve high efficiency, prevent gold finger copper leakage, The effect of easy operation

Active Publication Date: 2014-03-05
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is difficult to implement, the efficiency is low, and the effect of preventing gold finger copper leakage is not good

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The present embodiment provides a kind of circuit board production method that prevents golden finger from leaking copper, and its OSP process includes following processing:

[0030] Remove residual stains on the circuit board;

[0031] Micro-etch the copper surface of the circuit board;

[0032] Coating an organic anti-oxidation film on the copper surface;

[0033] The microetching of the copper surface of the wiring on the circuit board refers to immersing the circuit board in the microetching solution so that the copper surface is etched by 76 μ″ at a rate of 45 μ″ / min.

[0034] The microetching solution contains 90g / L of H 2 SO 4 , 56g / L of H 2 o 2 and the remainder of water.

[0035] In its nickel plating process, the nickel ion concentration of the nickel plating solution is 133g / L; in its gold plating process, the gold ion concentration of the gold plating solution is 2.6g / L.

[0036] A nickel layer cleaning process that can remove oxides, sulfides and cop...

Embodiment 2

[0045] The present embodiment provides a kind of circuit board production method that prevents golden finger from leaking copper, and its OSP process includes following processing:

[0046] Remove residual stains on the circuit board;

[0047] Micro-etch the copper surface of the circuit board;

[0048] Coating an organic anti-oxidation film on the copper surface;

[0049] The microetching of the copper surface of the wiring on the circuit board refers to immersing the circuit board in a microetching solution so that the copper surface is etched by 100 μ″ at a rate of 60 μ″ / min.

[0050] The microetching solution contains 80g / L of H 2 SO 4 , 70g / L of H 2 o 2 and the remainder of water.

[0051] In its nickel plating process, the nickel ion concentration of the nickel plating solution is 140g / L; in its gold plating process, the gold ion concentration of the gold plating solution is 3g / L.

[0052] A nickel layer cleaning process that can remove oxides, sulfides and copper...

Embodiment 3

[0061] The present embodiment provides a kind of circuit board production method that prevents golden finger from leaking copper, and its OSP process includes following processing:

[0062] Remove residual stains on the circuit board;

[0063] Micro-etch the copper surface of the circuit board;

[0064] Coating an organic anti-oxidation film on the copper surface;

[0065] The microetching of the copper surface of the wiring on the circuit board refers to immersing the circuit board in a microetching solution so that the copper surface is etched by 100 μ″ at a rate of 30 μ″ / min.

[0066] The microetching solution contains 20G / L of H 2 SO 4 , 40G / L of H 2 o 2 and the remainder of water.

[0067] In the nickel plating process, the nickel ion concentration of the nickel plating solution is 140g / L; in the gold plating process, the gold ion concentration of the gold plating solution is 1.8g / L.

[0068] A nickel layer cleaning process that can remove oxides, sulfides and copp...

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PUM

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Abstract

The invention provides a circuit board producing method for preventing golden fingers from exposing copper. The circuit board producing method is characterized in that the OSP process of the method comprises following processing: removing spots residing on a circuit board; micro-etching the copper surfaces of lines on the circuit board; and coating the copper surfaces with an organic solderability preservative, wherein micro-etching the copper surfaces of lines on the circuit board means that the circuit board is immersed in a micro-etching liquid in order that the copper surfaces are etched 80 to 100 [mu] " at a rate of 30 to 60 [mu] " / min. With the micro-etching operation, micro-etching liquid medicine, and the optimization of a gold plating process and a nickel plating process, the method effectively prevents a phenomenon of exposed golden finger copper which is commonly generated in a circuit board producing process and guarantees the quality of produced circuit boards. Compared with a method in the prior art in which the golden fingers are shielded by insulating material to be prevented from exposing copper, the method makes progress in operational simplification and increase in efficiency, and is especially suitable for large-scale industrialized popularization.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a circuit board production method for preventing gold finger copper leakage. Background technique [0002] The OSP (Organic Solderability Preservative, organic anti-oxidation film) process is a surface treatment performed in order to maintain good soldering performance on the copper surface of the soldering point during the circuit board process. Mainly use the organic matter of benzimidazole or phenylimidazole, configure it as an organic solderable copper surface protectant, make the copper surface react with it to form an organic copper complex, and appear as a layer of homogeneous, extremely thin, transparent organic coating lamination. This layer of film can effectively protect the copper surface from the corrosion of external corrosive or oxidative atmosphere, and achieve the effect of anti-oxidation. The manufacturing process is simple, the cost is low, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
Inventor 邹明亮张晃初夏国伟
Owner VICTORY GIANT TECH HUIZHOU CO LTD
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