Organic matter and slurry for chip oxygen sensor insulating layer

Abstract

The invention relates to an oxygen sensor, and in particular relates to a material of a chip oxygen sensor insulating layer. An organic matter for the chip oxygen sensor insulating layer is sepiolite, talcum, or mica. Slurry for the chip oxygen sensor insulating layer is prepared by adding the inorganic matter to an organic matter binding agent and an organic solvent, and implementing three-roller mixing and grinding, wherein the material of a chip oxygen sensor insulating layer comprises the following components in percentage by mass: 50-80% of the inorganic matter, 5-10% of the organic matter binding agent and 10-45% of the organic solvent. The inorganic matter, which uses sepiolite, talcum, or mica as an insulating layer of a chip oxygen sensor, can achieve purposes of high-temperature insulation and helping aluminum oxide sintering to form a dense layer.

Description

technical field [0001] The invention relates to an oxygen sensor, in particular to the material of the insulating layer of the chip oxygen sensor. Background technique [0002] In the oxygen sensor, a thin insulating layer is sandwiched between the heating electrode and the sensing electrode. This insulating layer can prevent the voltage of the heating electrode from affecting the output voltage signal when the operating temperature of the oxygen sensor is above 300°C. Patent CN102455311 discloses a composition of insulating layer, including 75 parts of aluminum oxide, 3 parts of silicon oxide, 5 parts of magnesium oxide, 15 parts of terpineol, and 2 parts of ethyl cellulose. The three oxides in this composition are all It is an oxide with a high melting point, and it cannot be co-sintered with the zirconia substrate during sintering, so there are still large pores after firing, which reduces the thermal shock resistance of the oxygen sensor; some patents add low-temperature...

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Problems solved by technology

Patent CN102455311 discloses a composition of insulating layer, including 75 parts of aluminum oxide, 3 parts of silicon oxide, 5 parts of magnesium oxide, 15 parts of terpineol, and 2 parts of ethyl cellulose. The three oxides in this composition are all It is an oxide with a high melting point, and it cannot be co-sintered with the zirconia substrate during sintering, so there are still large pores after firing, which reduces the thermal shock resistance of the oxygen sensor; some patents add low-temperature glaze to the insulating layer And alumina, low-temperature glaze can reduce the sintering temperature of alumina, but it will also bring a series of problems, such as low-temperature glaze has electronic conductivity at the operating temperature of the oxygen sensor, so the insulating layer cannot be insulated, and the output voltage is greater than 1.0V; BaAl is disclosed in other patents 2 Si 2 o 8 Instead of low-temperature glazes, but synthesizes BaAl in a suitable crystal form 2 Si 2 o 8 go through a lot of trouble