Chip multilayer ceramic connector and preparation method thereof

A technology of multi-layer ceramics and connectors, which is applied in the direction of connection, fixed connection, contact parts, etc., can solve the problem of large size of circuit connectors, and achieve the effect of small size and miniaturization

Active Publication Date: 2016-08-24
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The circuit connection and the physical connection on the circuit board should be guaranteed, and the current circuit connector is relatively large

Method used

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  • Chip multilayer ceramic connector and preparation method thereof
  • Chip multilayer ceramic connector and preparation method thereof
  • Chip multilayer ceramic connector and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0051] see image 3 , the preparation method of the chip type multilayer ceramic connector of an embodiment, comprises the following steps:

[0052] Step S110: Casting the ceramic slurry by a casting process to prepare a ceramic dielectric film.

[0053] Ceramic slurry is obtained by mixing porcelain material, organic binder and organic solvent. The ceramic material can be zirconium titanium strontium calcium (Ca-Sr-Ti-Zr) system ceramic material, barium neodymium titanium (Ba-Nd-Ti) system ceramic material or magnesium silicate (MgSiO 3 ) and other system porcelain materials.

[0054] Preferably, the ceramic material contains a general formula of Ca x Sr 1-x (Ti y Zr 1-y ) z o 3 The composite oxide, where 0

[0055] Preferably, the ceramic material further includes at least one of Mg oxide, Zn oxide, Si oxide, Mn oxide and Y oxide with a mass fraction of 0.1-5%.

[0056] The above-mentioned ceramic material has high insulation and low electric...

Embodiment 1

[0081] Preparation of multilayer ceramic connectors

[0082] 1. Mix titanium-strontium-calcium (Ca-Sr-Ti-Zr) system ceramic material, organic binder and organic solvent to obtain ceramic slurry, and use a casting process to cast the ceramic slurry to prepare a ceramic dielectric film. Wherein, the organic binder is polyvinyl butyral, and the organic solvent is a mixture of toluene and ethanol at a mass ratio of 1:1. The mass ratio of titanium strontium calcium (Ca-Sr-Ti-Zr) system ceramic material, organic binder and organic solvent is 50:20:30;

[0083] 2. Using a screen printing process to prepare internal electrode patterns on the ceramic dielectric film to obtain a ceramic dielectric film with internal electrode patterns attached. Among them, the diameter of the screen wire is 15 μm, the mesh number of the screen is 500 mesh, the torque of the screen stretcher is 22N / mm, and the exposure time is 20 seconds; the printing speed of the screen printing machine is 100mm / s, and...

Embodiment 2

[0089] 1. It will contain the general formula Ca x Sr 1-x (Ti y Zr 1-y ) z o 3 (0x Sr 1-x (Ti y Zr 1-y ) z o 3 (0

[0090]2. Using a screen printing process to prepare internal electrode patterns on the ceramic dielectric film to obtain a ceramic dielectric film with internal electrode patterns attached. Among them, the diameter of the screen wire is 16 μm, the mesh number of the screen is 500 mesh, the torque of the screen stretcher is 25N / mm, and the exposure time is 35 seconds; the printing speed of the screen printing machine is 200mm / s, and the laying speed is 150mm / s, the angle of the scraper is 65 degrees, and the mesh distance is 800mm;

[0091] 3. Laminating a plurality of ceramic dielectric films attached with internal electrode patterns to obtain a laminate, and laminating and cutting the laminate to form ceramic g...

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Abstract

The invention relates to a chip type multilayer ceramic connector and a preparation method thereof. The chip-type multilayer ceramic connector includes a chip-type ceramic dielectric body and a plurality of terminal electrodes arranged on the chip-type ceramic dielectric body and separated from each other. A conductive pattern is formed inside the chip-type ceramic dielectric body. The conductive pattern conducts at least two of the terminal electrodes. The conductive pattern inside the chip-type ceramic dielectric body of the chip-type multilayer ceramic connector can realize the conduction of at least two terminal electrodes, so that when the chip-type multilayer ceramic connector is applied to a circuit board, the electronic components can be realized. Conduction, and because the chip ceramic dielectric body is used as the dielectric structure, the volume is small, which can meet the miniaturization requirements of electronic products.

Description

technical field [0001] The invention relates to the technical field of electronic product accessories, in particular to a chip-type multilayer ceramic connector and a preparation method thereof. Background technique [0002] With the intelligent development of society, people have higher and higher requirements for the appearance and performance of electronic products, especially for the miniaturization of electronic products. [0003] Circuit connectors are generally used to connect components on circuit boards and act as a bridge connection. There are many circuit connectors required for each electronic product, and the structures of the circuit connectors are diverse. The circuit connection and the physical connection on the circuit board should be guaranteed, and the current circuit connector has a large volume. [0004] Circuit connectors should tend to be miniaturized in order to meet the miniaturization requirements of electronic products. Contents of the inventio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/02H01R13/40H01R13/46H01R12/51H01R43/00
Inventor 安可荣田述仁祝忠勇刘新许芳球黄旭业彭自冲陆亨
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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