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Resin composition and semi-flexible copper-clad plate made from resin composition

A resin composition, semi-flexible technology, applied in the direction of lamination, layered products, metal layered products, etc., can solve the problem that the adhesive sheet is easy to stick, the negative influence of the system heat resistance is large, and the heat resistance index problems such as lowering, to achieve the effect of high Tg value, high peel strength, and improved thermal shock resistance and impact resistance

Active Publication Date: 2014-02-12
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although rubber can provide the flexibility of the system, it has a great negative impact on the heat resistance of the system, resulting in a sharp drop in heat resistance indicators such as the glass transition temperature (Tg) of the system, and making the adhesive sheet easy to stick

Method used

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  • Resin composition and semi-flexible copper-clad plate made from resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The total weight is 100 parts, and the resin composition includes: 60 parts of phosphorus-containing epoxy resin (Dow Chemical, XZ92530), 10 parts of novolac epoxy resin (Hexion, EPR627), dimer acid addition modified bisphenol A epoxy resin (Hypox DA323) 15 parts, polyurethane modified epoxy resin (Nanya resin, NPER-133M) 12 parts, dicyandiamide 3 parts.

[0026] The method for preparing a semi-flexible copper-clad laminate from the above-mentioned resin composition comprises the steps of:

[0027] 1) Weigh the components in the composition according to the formula and mix them evenly, add 0.5% accelerator 2-methylimidazole of the total weight of the composition and organic solvent acetone to make a glue, and the solid content of the glue is 30%;

[0028] 2) Stir and mix the glue evenly, dip it on 1080 glass cloth, and bake it in an oven at 155°C for 5 minutes to remove the solvent to obtain a prepreg;

[0029] 3) Take a single sheet of the prepreg obtained in step 2),...

Embodiment 2

[0032] The total weight is 100 parts, and the resin composition includes: 65 parts of phosphorus-containing epoxy resin (Dow Chemical, XZ92530), 5 parts of novolak epoxy resin (Hexion, EPR627), dimer acid addition modified bisphenol A epoxy resin (Hypox DA323) 12 parts, polyurethane modified epoxy resin (Nanya resin, NPER-133M) 15 parts, dicyandiamide 3 parts.

[0033] The method for preparing a semi-flexible copper-clad laminate from the above-mentioned resin composition comprises the steps of:

[0034] 1) Weigh the components in the composition according to the formula and mix them evenly, add 0.5% accelerator 2-methylimidazole of the total weight of the composition and organic solvent acetone to make a glue, and the solid content of the glue is 30%;

[0035] 2) Stir and mix the glue evenly, dip it on 1080 glass cloth, and bake it in an oven at 155°C for 5 minutes to remove the solvent to obtain a prepreg;

[0036] 3) Take a single sheet of the prepreg obtained in step 2), ...

Embodiment 3

[0039] The total weight is 100 parts, and the resin composition includes: 70 parts of phosphorus-containing epoxy resin (Dow Chemical, XZ92530), 7 parts of novolak epoxy resin (Hexion, EPR627), dimer acid addition modified bisphenol A epoxy resin (Hypox DA323) 10 parts, polyurethane modified epoxy resin (Nanya resin, NPER-133M) 10 parts, dicyandiamide 3 parts.

[0040] The method for preparing a semi-flexible copper-clad laminate from the above-mentioned resin composition comprises the steps of:

[0041] 1) Weigh the components in the composition according to the formula and mix them evenly, add 0.5% accelerator 2-methylimidazole of the total weight of the composition and organic solvent acetone to make a glue, and the solid content of the glue is 30%;

[0042] 2) Stir and mix the glue evenly, dip it on 1080 glass cloth, and bake it in an oven at 155°C for 5 minutes to remove the solvent to obtain a prepreg;

[0043] 3) Take a single sheet of the prepreg obtained in step 2), ...

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Abstract

The invention provides a resin composition and a semi-flexible copper-clad plate prepared from the resin composition. The resin composition comprises the following components in parts by weight of: 60-70 parts of phosphorus-containing epoxy resin, 5-10 parts of novolac epoxy resin, 10-20 parts of bisphenol A epoxy resin modified through dimer acid addition, 10-20 parts of polyurethane modified epoxy resin and 2-4 parts of dicyandiamide. The resin composition is characterized in that the polyurethane modified epoxy resin and the bisphenol A epoxy resin modified through dimer acid addition are introduced so that the tenacity of the system is enhanced and the influence on the Tg of the system is low; as a result, the system is capable of achieving the balance between flexibility and Tg; the semi-flexible copper-clad plate made from resin composition has more excellent flexibility than common FR-4, and is capable of keeping a high Tg value.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a resin composition and a semi-flexible copper-clad laminate produced therefrom. Background technique [0002] The miniaturization and multi-function of electronic products, especially the miniaturization and high performance of consumer electronic products have become an obvious trend, which requires PCB to achieve high density and high performance. Under this premise, flexible boards and rigid-flexible boards have shown advantages. These special-structure PCB boards can significantly reduce the volume occupied by electronic products and achieve dense assembly and three-dimensional assembly. [0003] At present, the reinforcing material used in the flexible copper clad laminate (FCCL) is PI film, and the reinforcing material used in the flexible part of the rigid-flexible board is also PI film. PI film has excellent flexural performance but high cost, which leads ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08L63/02B32B15/092B32B37/06
Inventor 汪青
Owner GUANGDONG SHENGYI SCI TECH
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