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Photoresist composition and method for processing glass

A technology of photosensitive resin and processing method, which is applied in the direction of photosensitive materials, optics, and optomechanical equipment used in optomechanical equipment. Suppression of undercutting and high etching resistance

Active Publication Date: 2014-01-29
TOKYO OHKA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Conventionally, physical methods have been generally used as processing methods for such glass substrates, but there have been problems in that internal cracks are likely to occur during processing, resulting in lower strength and lower yields.

Method used

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  • Photoresist composition and method for processing glass
  • Photoresist composition and method for processing glass
  • Photoresist composition and method for processing glass

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0176]

[0177] The photosensitive resin composition for glass processing according to the present invention can be prepared by merely mixing and stirring the above-mentioned components by a usual method, and if necessary, disperse them using a dissolver, a homogenizer, a three-roll mill, etc. machine for dispersion and mixing. In addition, after mixing, filtration may be further performed with a mesh, a membrane filter, or the like.

[0178] "Glass Processing Method"

[0179] The first glass processing method according to the present invention includes a resin layer forming step of forming a resin layer containing the first photosensitive resin composition for glass processing according to the present invention on a glass substrate, and an exposing step of selectively exposing the resin layer. , a developing step of developing the exposed resin layer to form a resin pattern, an etching step of etching the glass substrate using the resin pattern as a mask, and a peeling ste...

Embodiment 17～20

[0261] Formation of resin layer using dry film

[0262] After coating the positive-type photosensitive resin composition of Example 1, 4 or 5 or the negative-type photosensitive resin composition of Example 12 on a support film comprising a PET film with an applicator, the coating was carried out at 120° C. The film was heated and dried for 10 minutes to obtain a dry film including a resin layer with a film thickness of 60 μm. The support film was peeled off from the dry film, and the newly exposed surface of the dry film was attached to a glass substrate (manufactured by Corning, Eagle-XG, thickness 0.7mm), and bonded to the glass substrate by thermal compression bonding using a heated roller. Cover with dry film. At this time, the surface temperature of the roll was heated to 80° C., the roll pressure was set to 0.1 MPa (G), and the moving speed was set to 0.1 m / min. In addition, the glass substrate was preheated to 60°C.

[0263] Developability, resolution, etching resis...

Embodiment 21～55、 comparative example 8～21

[0268] According to the formulations (units are parts by mass) recorded in Tables 9 to 13, mix resins with hydroxyl groups, fillers, rheology modifiers, compounds containing quinone diazide groups, polyvinyl alkyl ethers and solvents, and prepare examples 21-42 and the positive-type photosensitive resin compositions of Comparative Examples 8-15.

[0269] In addition, according to the formulations (units are parts by mass) recorded in Tables 14 to 16, resins with hydroxyl groups, fillers, rheology modifiers, crosslinking agents, acid generators, polyvinyl alkyl ethers and solvents were mixed to prepare and implement Negative photosensitive resin compositions of Examples 43-55 and Comparative Examples 16-21.

[0270] Details of each component in Tables 9 to 16 are as follows.

[0271] Resins A to I having hydroxyl groups: Same as above

[0272] Packing A~C and E: Same as above

[0273] Filler D': silica fine particles (manufactured by Japan Aerosil Corporation, AEROSIL (regis...

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Abstract

The invention provides a photoresist composition for processing glass with high etching resistance and excellent resolution ratio and lateral erosion inhibiting property, in order to form a resin pattern with high aspect ratio and a method for processing glass using the composition. The invention provides a photoresist composition for processing glass with high etching resistance and excellent resolution ratio and liquid dropping inhibiting property and a method for processing glass using the composition. The first composition comprises hydroxy-containing resin whose weight-average molecular weight is above 20000 and at least one filler selected from polyolefin particle and inorganic salt particle. The second composition comprises hydroxy-containing resin whose weight-average molecular weight is above 20000, filler and rheology modifier. The method for processing glass comprises the following steps: forming a resin layer containing the compositions on a glass substragte, an exposing the layer selectively; devoloping a pattern on the exposed resin layer; etching the glass substrate using the resin pattern as a masking; peeling the resin pattern.

Description

technical field [0001] The present invention relates to a photosensitive resin composition for glass processing and a glass processing method for etching a glass substrate using a resin pattern obtained by patterning the photosensitive resin composition for glass processing as a mask. Background technique [0002] In the touch panel, a transparent conductive material such as ITO is formed into a film on the opposing surface of the glass substrate and the film material facing each other through a spacer. In this touch panel, the contact position of the film material is detected as coordinate information. [0003] In addition, recently, a touch panel-integrated liquid crystal display has also been proposed. In this regard, one of the two glass substrates constituting the liquid crystal display also serves as the glass substrate of the touch panel, which is very effective in reducing the thickness and weight. [0004] Conventionally, physical methods have been generally used ...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/00
Inventor 植松照博土居香织
Owner TOKYO OHKA KOGYO CO LTD
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