Simulated liquid absorbing core for heat uniformizing plate

Abstract

The invention discloses a simulated liquid absorbing core for a heat uniformizing plate. The simulated liquid absorbing core is structurally characterized in that based on efficient transport structure of a plant leaf, a novel heat uniformizing plate in the simulated transport structure of the plant leaf is designed according to the point-to-surface transport principle of the plant leaf and the shortest path principle of transport. The heat uniformizing plate can be integrally designed with the liquid absorbing core, so that working medium can quickly enter a fractal passage under the action of capillary pressure, can quickly enter a polygonal microstructure tissue enclosed by the fractal passage and can reach the integral condensing surface of the heat uniformizing plate rapidly, and the working medium is quickly condensed into liquid state and can return to an evaporating end under the action of the capillary pressure, and one cycle is completed for preparation of the next evaporation. Meanwhile, due to the polygonal micropassage structure of a simulated vein structure, the liquid working medium is promoted to quickly flow to the periphery of a condensing end along the network passage of the liquid absorbing core, circulation of a working medium transport loop is accelerated, heat transfer efficiency is improved, and the simulated liquid absorbing core is small in size and applicable to precise electronic equipment.

Description

technical field [0001] The invention relates to a bionic soaking plate liquid-absorbing core structure, which effectively overcomes the defects of the existing soaking plate liquid-absorbing core technology such as large flow resistance, slow transmission, local microchannel blockage, low temperature uniformity, and low strength. , can efficiently solve the problem of local heat dissipation of electronic devices. Background technique [0002] With the development of electronic technology, circuit integration technology continues to promote the increasingly sophisticated electronic products. At the same time, highly integrated electronic devices have caused a sharp increase in heat flux, and heat dissipation has become an insurmountable bottleneck in the development of electronic technology. As an efficient heat transfer device, the vapor chamber has been widely used in the heat dissipation of electronic equipment. As the core structure of the vapor chamber, the liquid-abso...

AI Technical Summary

Problems solved by technology

At the same time, the thickness of the vapor chamber is small in the height direction, and with the development of electronic technology, the vapor chamber is required to be thinner and thinner, so the wall of the vapor chamber will become thinner to increase the volume of the chamber of the vapor chamber , but this will reduce the strength of the vapor chamber, which will cause the vapor chamber to deform or collapse after vacuuming

Therefore, in order to increase the strength, support columns are added to the vapor chamber, but the increase of support columns will greatly reduce the evaporation area, and at the same time, it will cause changes in the flow field in the chamber of the chamber, which is not conducive to the improvement of heat dissipation efficiency

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