Conductive adhesive type resurrection-preventing radio frequency tag and manufacturing method thereof

Abstract

The invention relates to a recording carrier, in particular to a resurrection-preventing radio frequency tag. The invention further relates to a manufacturing method of the radio frequency tag and aims at providing a conductive adhesive type resurrection-preventing radio frequency tag easy to manufacture and good in resurrection-preventing effect and a manufacturing method thereof. The conductive adhesive type resurrection-preventing radio frequency tag comprises a capacitor pole plate (1), wherein a decoding point (2) is arranged on the capacitor pole plate, and a conductive adhesive (3) is cured in the decoding point and on the pole plate surface on the periphery of the decoding point. The manufacturing method of the conductive adhesive type resurrection-preventing radio frequency tag comprises the following steps of stamping a micro-concave face on the capacitor pole plate of a radio frequency tag circuit to obtain the decoding point; dropwise adding the uncured conductive adhesive on the decoding point and enabling the conductive adhesive to flow into the decoding point and cover the periphery of the decoding point; placing the tag in the conductive adhesive curing temperature environment to enable the conductive adhesive to be cured.

Description

technical field [0001] The invention relates to a record carrier for use with a machine, in particular to a radio frequency tag for anti-reactivation. The invention also relates to a manufacturing method of the radio frequency tag. Background technique [0002] Radio frequency tags are more and more widely used in various fields, and their shapes and specifications can be in various forms according to needs. The simplest radio frequency tag circuit such as figure 1 As shown, the capacitor 11' and the inductor 12' form the LC oscillation circuit. Its production process is generally as follows: figure 2 As shown, a layer of dielectric film 22' is filled between two layers of aluminum 21', and these three layers of materials are compositely bonded together with hot melt adhesive 23', and then as shown in image 3 As shown, the inductor and capacitor are printed and etched on two layers of aluminum respectively, and then they are connected to form a circuit. The radio freq...

AI Technical Summary

Problems solved by technology

However, the actual operation of this technology is very difficult, and the scrap rate is high. Often the label has been broken due to external force before it is applied to the product and becomes invalid.

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