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Elastic base/back surface line leading-based micro-electromechanical systems probe card and preparation method thereof

A micro-electromechanical system and probe card technology, which is applied in the direction of measuring electricity, measuring electrical variables, and manufacturing measuring instruments, etc., can solve the problems of low yield and long connecting line, etc. The effect of short circuit length

Inactive Publication Date: 2013-11-27
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the connecting wire to the external printed circuit board is too long, and spot welding is required, resulting in low yield

Method used

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  • Elastic base/back surface line leading-based micro-electromechanical systems probe card and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This embodiment provides a micro-electromechanical system probe card based on an elastic substrate and back leads and a preparation method. Using the method of back leads, the structural parameters of the prepared probe card are: ceramic substrate, substrate thickness 1mm, substrate Through-chip hole diameter 200μm, first metal seed layer thickness 200nm, polydimethylsiloxane elastic polymer layer thickness 150μm, elastic polymer through-hole structure diameter 200μm, second metal seed layer thickness 100nm, copper metal circuit layer thickness 5μm, line width 100μm, metal probe structure height 75μm.

[0039] Such as figure 1 Shown, the preparation method in this implementation comprises the following steps:

[0040] The first step is to punch through holes on the substrate;

[0041] A ceramic sheet with a thickness of 1 mm was used as the substrate, and a through-hole with a diameter of 200 μm was prepared by mechanical drilling; it was ultrasonically cleaned with d...

Embodiment 2

[0055] This embodiment provides a micro-electromechanical system probe card based on an elastic substrate and back leads and a preparation method. Using the method of back leads, the structural parameters of the prepared probe card are: PCB substrate, substrate thickness 2mm, substrate Diameter of through-chip hole is 100 μm, thickness of first metal seed layer is 100 nm, thickness of polydimethylsiloxane elastic polymer layer is 250 μm, diameter of elastic polymer via structure is 150 μm, thickness of second metal seed layer is 200 nm, thickness of copper metal circuit layer 10μm, line width 50μm, metal probe structure height 100μm.

[0056] Such as figure 1 Shown, the preparation method in this implementation comprises the following steps:

[0057] The first step is to punch through holes on the substrate;

[0058] A PCB with a thickness of 2mm is used as the substrate, and a through-hole with a diameter of 100 μm is prepared by laser hole method; it is ultrasonically clea...

Embodiment 3

[0072] This embodiment provides a MEMS probe card based on an elastic substrate and back leads and its preparation method. The probe card structure parameters prepared by using the back lead method are: silicon substrate, substrate thickness 500 μm, substrate The diameter of the via hole is 30 μm, the thickness of the first metal seed layer is 50 nm, the thickness of the polydimethylsiloxane elastic polymer layer is 40 μm, the diameter of the elastic polymer via structure is 30 μm, the thickness of the second metal seed layer is 20 nm, and the thickness of the copper metal circuit layer is 2 μm , the line width is 5 μm, and the height of the metal probe structure is 30 μm.

[0073] Such as figure 1 Shown, the preparation method in this implementation comprises the following steps:

[0074] The first step is to punch through holes on the substrate;

[0075] A silicon wafer with a thickness of 500 μm was used as the substrate, and through holes with a diameter of 30 μm were pr...

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Abstract

The invention provides an elastic base / back surface line leading-based micro-electromechanical system probe card and a preparation method thereof. The preparation method comprises the following steps that: a substrate through hole is slotted on a substrate; a substrate metal structure is by electroformed the substrate through hole, and a first metal seed layer is sputtered on the back surface of the substrate; an elastic polymer layer is in coated on the substrate, and an elastic polymer through hole structure is prepared on the elastic polymer layer; an elastic polymer metal structure is electroformed in the elastic polymer through hole structure; a second metal seed layer is sputtered on the elastic polymer layer, and a metal circuit layer is prepared on the second metal seed layer; a metal probe structure is prepared on the metal circuit layer; the first and second metal seed layers are removed, and the substrate is arranged on a printed circuit board in a surface mounting manner, such that the elastic base / back surface lead line-based micro-electromechanical systems probe card can be obtained. According to the elastic base / back surface line leading-based micro-electromechanical system probe card and the preparation method thereof provided by the invention, a back surface line leading method is adopted so as to directly connect the prepared probe card with a testing machine stage change-over card; and the elastic base / back surface line leading-based micro-electromechanical system probe card and the preparation method thereof are advantageous in omission of spot welding procedures, simplification of process and improvement of rate of finished products.

Description

technical field [0001] The invention relates to the technical field of integrated circuit testing, in particular to a MEMS probe card based on an elastic substrate and back leads and a preparation method thereof, and the probe card prepared by the method is used for testing integrated circuit chips. Background technique [0002] The probe card is a key component in the packaging and testing process of integrated circuit chips, and is used for testing of integrated circuit products before packaging. With the development of semiconductor manufacturing technology, the complexity of integrated circuit chips continues to increase, resulting in an increase in the number of chip pins and a continuous decrease in pin spacing. At the same time, the improvement of the operating frequency of the radio frequency circuit makes the traditional epoxy resin or vertical needle probe card test the chip, the parasitic capacitance and inductance generated by the parallel arrangement of the prob...

Claims

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Application Information

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IPC IPC(8): G01R1/073G01R3/00
Inventor 陈迪袁涛谢耀林彬彬崔大祥
Owner SHANGHAI JIAO TONG UNIV
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