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Packaging-prior-to-etching chip-normally-bonded type three-dimensional system-level metal circuit board structure and process method thereof

A technology of metal circuit sealing first and etching later, which is applied in the direction of circuits, semiconductor/solid-state device components, semiconductor devices, etc., and can solve the problems of limiting the functionality and application performance of metal lead frames

Active Publication Date: 2013-11-20
江阴芯智联电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a three-dimensional system-level metal circuit board structure and process method for sealing first and then etching chips, which can solve the problem that traditional metal lead frames cannot be embedded in objects and limit the functionality and application of metal lead frames. performance

Method used

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  • Packaging-prior-to-etching chip-normally-bonded type three-dimensional system-level metal circuit board structure and process method thereof
  • Packaging-prior-to-etching chip-normally-bonded type three-dimensional system-level metal circuit board structure and process method thereof
  • Packaging-prior-to-etching chip-normally-bonded type three-dimensional system-level metal circuit board structure and process method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0215] Example 1: single-layer circuit single-chip front-mounted single-turn pins (1)

[0216] see Figure 19, the present invention is a three-dimensional system-level metal circuit board structure that is sealed first and then etched. There are conductive pillars 4, the front of the base island 2 is equipped with a chip 5 through a conductive or non-conductive adhesive substance, the front of the chip 5 is connected to the front of the pin 3 by a metal wire 6, the base island 2, the lead Foot 3, conductive pillar 4, chip 5 and the peripheral area of ​​metal wire 6 are encapsulated with molding compound or epoxy resin 8, and the molding compound or epoxy resin 8 is flush with the top of conductive pillar 4, and the metal substrate frame 1, An anti-oxidation layer 7 is provided on the surfaces of the base island 2 , pins 3 and conductive pillars 4 exposed from the molding compound or epoxy resin 8 .

[0217] Its process method is as follows:

[0218] Step 1. Take the metal ...

Embodiment 2

[0254] Embodiment 2: single-layer circuit single-chip front-mounted single-turn pins (2)

[0255] see Figure 41 , the present invention is a three-dimensional system-level metal circuit board structure that is sealed first and then etched. There are conductive pillars 4, the front of the base island 2 is equipped with a chip 5 through a conductive or non-conductive adhesive substance, the front of the chip 5 is connected to the front of the pin 3 by a metal wire 6, the base island 2, the lead Foot 3, conductive pillar 4, chip 5 and metal wire 6 peripheral areas are encapsulated with molding compound or epoxy resin 8, the molding compound or epoxy resin 8 is flush with the top of conductive pillar 4, and the base island 2 and lead A highly conductive metal layer 9 is provided on the back of the foot 3, and green paint or photosensitive non-conductive adhesive material 10 is filled between the highly conductive metal layer 9 and the highly conductive metal layer 9. The metal s...

Embodiment 3

[0300] Embodiment 3: Multi-layer circuit single-chip front-mounted single-turn pins

[0301] see Figure 84 , the present invention is a three-dimensional system-level metal circuit board structure that is sealed first and then etched. There are conductive pillars 4, the front of the base island 2 is equipped with a chip 5 through a conductive or non-conductive adhesive substance, the front of the chip 5 is connected to the front of the pin 3 by a metal wire 6, the base island 2, the lead Foot 3, conductive pillar 4, chip 5 and the peripheral area of ​​metal wire 6 are encapsulated with molding compound or epoxy resin 8, and the molding compound or epoxy resin 8 is flush with the top of conductive pillar 4, and the metal substrate frame 1, An anti-oxidation layer 7 is provided on the surfaces of the base island 2 , pins 3 and conductive pillars 4 exposed from the molding compound or epoxy resin 8 .

[0302] The difference between embodiment 3 and embodiment 1 is that: both t...

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Abstract

The invention relates to a packaging-prior-to-etching chip-normally-bonded type three-dimensional system-level metal circuit board structure and a process method thereof. The structure comprises a metal substrate frame (1), wherein pins (3) are arranged in the metal substrate frame (1); conductive columns (4) are arranged on the front surfaces of the pins (3); a chip (5) is normally bonded on the front surface of the metal substrate frame (1) or between each two pins (3); the front surfaces of the chips (5) and the pins (3) are connected through metal wires (6); molding compounds (8) are encapsulated in the peripheral areas of the pins (3), the conductive columns (4), the chips (5) and the metal wires (6) and are level with the tops of the conductive columns (4); and anti-oxidation layers (7) are arranged on the surfaces, exposed from the molding compounds (8), of the metal substrate frame (1), the pins (3) and the conductive columns (4). The packaging-prior-to-etching chip-normally-bonded type three-dimensional system-level metal circuit board structure and the process method thereof have the beneficial effect that the problem of limitation of the functionality and application performance of a metal lead frame caused by difficulty in embedding of an object into a conventional metal lead frame can be solved.

Description

technical field [0001] The invention relates to a three-dimensional system-level metal circuit board structure and process method for sealing first and then etching chips, and belongs to the technical field of semiconductor packaging. Background technique [0002] The basic manufacturing process methods of traditional metal lead frames are as follows: [0003] 1. Take a metal sheet and use the technology of mechanical upper and lower tool punching to make punching from top to bottom or bottom to top in a longitudinal manner (see Figure 91 ), so that the lead frame can be formed in the metal sheet with the base island carrying the chip and the inner pins for signal transmission and the outer pins connected to the external PCB, and then the inner pins and / or some areas of the base island Metallization coating to form a real usable leadframe (see Figure 92 , 93 ); [0004] 2. Take a metal sheet and use chemical etching technology for exposure, development, window opening, ...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/56H01L23/495H01L23/31
CPCH01L2224/32013H01L23/49517H01L23/49811H01L23/49822H01L21/4821H01L21/4825H01L21/4853H01L21/4857H01L24/16H01L2224/32145H01L2224/32225H01L2224/48091H01L2224/48137H01L2224/48227H01L2224/73204H01L2224/73265H01L2224/92247H01L2924/19105H01L2924/19107H01L23/3107H01L21/561H01L21/568H01L2924/351H01L2224/45147H01L2924/181H01L2224/16258H01L24/32H01L24/45H01L24/48H01L24/49H01L24/73H01L24/97H01L2224/16225H01L2224/2919H01L2224/2929H01L2224/32245H01L2224/49171H01L2924/07802H01L2924/0781H01L2924/18165H01L2224/97H01L2924/00014H01L23/49575H01L2924/00012H01L2224/48247H01L2924/00H01L2224/43H01L2224/16245H01L23/293H01L25/50
Inventor 梁新夫梁志忠林煜斌王亚琴张友海
Owner 江阴芯智联电子科技有限公司
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