Multi-layer nanometer composite thin film material for high-speed high-density phase transition storage and method for preparing material
A technology of phase change memory and thin film material, which is applied in the field of materials in the field of microelectronics technology, and can solve the problems that the phase change speed needs to be improved, and the requirements cannot be fully met.
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Embodiment 1
[0022] [SS (anm) / GS (bnm)] prepared in the present embodiment x The specific material structure is [SS(4nm) / GS(10nm)] 4 .
[0023] Its preparation steps are:
[0024] 1. Clean SiO2 2 / Si(100) substrate, cleaning the surface and back, removing dust particles, organic and inorganic impurities;
[0025] a) strong ultrasonic cleaning in acetone solution for 3-5 minutes, and rinse with deionized water;
[0026] b) Strong ultrasonic cleaning in ethanol solution for 3-5 minutes, rinse with deionized water, high-purity N 2 Blow dry the surface and back;
[0027] c) Dry the water vapor in an oven at 120°C for about 20 minutes.
[0028] 2. Prepared by magnetron sputtering [SS(4nm) / GS(10nm)]4 Preparation before multilayer composite film:
[0029] a) Install SbSe and Ga 30 Sb 70 Sputtering target material, the purity of the target material reaches 99.999% (atomic percentage), and the background vacuum is evacuated to 1×10 -4 Pa;
[0030] b) Set the sputtering power to 20W;
[...
Embodiment 2
[0040] [SS(anm) / GS(bnm)] prepared in this example x The specific structures of nano phase change thin film materials are [SS(5nm) / GS(10nm)] 3 and [SS(6nm) / GS(10nm)] 3 , and the [SS(5nm) / GS(10nm)] 3 and [SS(6nm) / GS(10nm)] 3 The thickness of the multi-layer phase change thin film material is about 50nm.
[0041] Above [SS(5nm) / GS(10nm)] 3 and [SS(6nm) / GS(10nm)] 3 The preparation method of the multilayer composite phase change thin film material is the same as that of Example 1.
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