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Low-density ablation-resistant polymer-based composition

A polymer and ablation-resistant technology, which is applied in the field of polymer-based thermal protection composite materials, can solve problems such as low decomposition temperature, poor erosion resistance, and reduced thermal conductivity, and achieve simple preparation process, improved comprehensive performance, Inhibits the effect of oxidation and cracking

Active Publication Date: 2013-09-25
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] From the analysis of existing literature reports, hollow phenolic microspheres have a significant effect in reducing density and thermal conductivity, but their decomposition temperature is not high. Hollow glass microspheres begin to melt at about 600 ° C, and the erosion resistance is poor after forming a liquid phase. Ceramic microspheres have better ablation resistance but higher density

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Example 1: Low Density Ablation Resistant Polymer Based Composition

[0027] The composition is mainly composed of 100 parts of boron phenolic resin, 10-45 parts of modified hollow phenolic microspheres, 4-40 parts of modified hollow ceramic microspheres, 5-15 parts of glass frit, and 100 parts of absolute ethanol. The sum of the mass parts of the phenolic microspheres and the modified hollow ceramic microspheres is ≤50, all of which are parts by mass.

[0028] The boron phenolic resin is made by replacing hydrogen atoms in part of the phenolic hydroxyl groups in ordinary phenolic resins with boron atoms, wherein the boron content is ≥ 2.5%, and the average molecular weight is ≥ 400.

[0029] The modified hollow phenolic microspheres are obtained by modifying the hollow phenolic microspheres with 3-aminopropyltriethoxysilane coupling agent, the particle size is 2-300 μm, and the density is 0.09-0.2 g / cm 3 , the specific modification method is: add the ethanol aqueous s...

Embodiment 2

[0032] Example 2: Preparation of Low Density Ablation Resistant Polymer Based Composition

[0033] (1) Weigh 100g of boron phenolic resin and pulverize it into powder with a particle size of 1-20μm, dissolve it with 100g of absolute ethanol, stir it evenly, seal it, and set aside.

[0034] (2) Prepare 0.2 g of 3-aminopropyltriethoxysilane coupling agent into 1% ethanol aqueous solution (the volume ratio of ethanol to distilled water is 9:1), weigh 20 g of hollow phenolic microspheres, and add the coupling agent solution After fully stirring and mixing in the mixture for 2 hours, let it stand for 30 minutes, then filter off the supernatant, and then wash the hollow phenolic microspheres treated with the coupling agent with ethanol aqueous solution, and dry them for later use.

[0035](3) Prepare 0.2g of 3-aminopropyltriethoxysilane coupling agent into 1% ethanol aqueous solution (the volume ratio of ethanol to distilled water is 9:1), add 20g of hollow ceramic microspheres, sti...

Embodiment 3

[0037] Example 3: Preparation of Low Density Ablation Resistant Polymer Based Composition

[0038] (1) Weigh 100g of boron phenolic resin and pulverize it into powder with a particle size of 1-20μm, dissolve it with 100g of absolute ethanol, stir it evenly, seal it, and set aside.

[0039] (2) Prepare 0.15 g of 3-aminopropyltriethoxysilane coupling agent into 1% ethanol aqueous solution (the volume ratio of ethanol to distilled water is 9:1), weigh 30 g of hollow phenolic microspheres, and add the coupling agent solution After fully stirring and mixing in the mixture for 2 hours, let it stand for 30 minutes, then filter off the supernatant, and then wash the hollow phenolic microspheres treated with the coupling agent with ethanol aqueous solution, and dry them for later use.

[0040] (3) Prepare 0.2g of 3-aminopropyltriethoxysilane coupling agent into 1% ethanol aqueous solution (the volume ratio of ethanol to distilled water is 9:1), add 10g of hollow ceramic microspheres, s...

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PUM

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Abstract

The invention discloses a low-density ablation-resistant polymer-based composition. The low-density ablation-resistant polymer-based composition has density less than 1g / cm<3> and a residual weight rate more than 70% at a temperature of 900 DEG C. The low-density ablation-resistant polymer-based composition comprises, by mass, 100 parts of boron-containing phenolic resin, 10 to 45 parts of modified hollow phenolic resin microspheres, 5 to 40 parts of modified hollow ceramic microspheres, 5 to 15 parts of frit and 100 parts of anhydrous ethanol as a solvent, wherein the number of the total mass parts of the modified hollow phenolic resin microspheres and the modified hollow ceramic microspheres is less than 50. Through the synergism of the modified hollow phenolic resin microspheres and the modified hollow ceramic microspheres, material ablation-resistant integrated properties are improved. In fusion, the frit can inhibit oxidation and cracking of the phenolic resin microspheres and a polymer matrix and produce protection and reinforcement effects.

Description

technical field [0001] The invention relates to the technical field of polymer-based thermal protection composite materials, in particular to a low-density ablation-resistant polymer-based composition and a preparation method thereof. It can be used in aerospace, fire prevention and heat insulation and other fields. Background technique [0002] Polymer-based ablative materials play a very important role in thermal protection materials because of their good ablation performance, low cost, strong designability, simple molding process, and low density. Commonly used polymer matrices include silicone resin, phenolic resin, bismaleimide resin, polyaryleacetylene resin, benzoxazine resin, etc. and their modified products. Fillers include hollow phenolic microspheres, hollow glass microspheres, etc., which mainly serve to reduce thermal conductivity, improve heat insulation efficiency, enhance erosion resistance, and reduce ablation rate. [0003] The phenolic microspheres and g...

Claims

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Application Information

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IPC IPC(8): C08L61/14C08K9/06C08K7/24C08K3/40
Inventor 石敏先黄志雄秦岩张联盟张明丁杰祁一信余龙颖
Owner WUHAN UNIV OF TECH
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